Abstract: A reflow miniovens is available for soldering/desoldering of BGA and SMT individual components on a printed circuit board (PCB). The minioven is comprised of an apparatus whose top and side oven walls are configured as a gas delivery head terminating in a detachable nozzle fitted over the component, which gas delivery head provides gas delivery and vacuum application apparatus, and with the oven bottom being the PCB and the component being soldered/desoldered being positioned directly above a preheater placed in a table on which an open frame construction board holder holding the PCB is supported, allowing placement of any surface on the PCB in direct and unobstructed view of the preheater. The nozzle is configured to direct heated gas to the component and to direct exhaust gas to a level above the PCB to avoid heating neighboring components on the PCB.

Abstract: An IC component extraction hand tool, especially for PCCs in a socket, comprising a base member for engaging the socket, a handle on the base member, and a resilient wire mounted to the handle and passing through holes in the base member and having hook ends which upon actuation of the wire can be caused to engage the component during an extraction operation.

Abstract: A novel low profile IC test clip for removable attachment to a DIP IC having substantially fixed contacts for sliding engagement with the IC pins, locking means at the ends, which are uncoupled to the contacts, and a laterally extending multi-conductor cable internally connected to the contacts.