Abstract: A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by rough grinding with a pair of cup wheel type rough grinding grindstones. A pair of cup wheel type finishing grinding grindstones are used to chamfering by finishing grinding the four-corner round surfaces and the four sides of the block.

Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Abstract: A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which substrate holders that compose three stages of a substrate loading/unloading stage, a rough grinding stage, a finish grinding stage are arranged in a concentric pattern on the first index rotary table, and a polishing process stage that has a substrate holder table composing a substrate loading/unloading/finish polishing stage as well as a substrate holder table composing a rough polishing stage arranged in a concentric pattern on the second index rotary table.

Abstract: Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.

Abstract: A non-contact type hydrostatic linear guide device includes a guide unit having a pair of rail parts on the top surface thereof, and a slide unit having oil pockets in a running surface thereof. A load of the slide unit concentrates on the frame of the guide unit. The slide unit has a stepped leg structure in which projections are disposed in the under surface of a table thereof in bilateral symmetry. The projections contact the top surface of inner projections disposed on the guide unit and the outer side surfaces thereof face the inner surfaces of the wear plates disposed on the guide unit, and wear plates are placed outward in the midway of the under surfaces of the projections as the side surfaces thereof face the both side surfaces of the first recessed part and the third recessed part of the guide unit.

Abstract: An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When the value of the vibration signals falls below a trigger level, a work table direction of motion is reversed.

Abstract: A method of detecting an end point of polishing arranged to perform CMP polishing with which an insulating layer of a wafer incorporating a substrate having a metal-containing permalloy layer formed thereon and the insulating layer formed on the metal-containing permalloy layer is chemimechanically polished to expose the flat permalloy layer, the method of detecting an end point of polishing, having the steps of: collecting abrasive material slurry on a surface plate for polishing as a continuous flow from the start or during CMP polishing; continuously mixing a color developing reagent with the collected continuous flow to prepare a specimen for the continuos flow; reading the color of the specimen as a digital value (Ii) by a color identifying sensor; and determining a moment of time at which the digital value (Ii) reaches a digital value (Io) of a specimen of a waste flow of the abrasive material slurry at the end of polishing to be the end of CMP polishing.

Abstract: A method for rotating a machining portion of an electrodischarge machine, in which a tool electrode holder mounted to a clamp holder to hold a tool electrode is rotated by virtue of a reaction force induced by the jet of a machining fluid to thereby rotate the tool electrode with respect to a workpiece. More specifically, the machining fluid is allowed to flow in the interior of the tool electrode holder and is conducted toward the outer peripheral surface of the tool electrode holder, then is further conducted in an inclined direction relative to the radial direction from the outer peripheral surface of the tool electrode holder and is jetted. Thus, the tool electrode holder is rotated by the force of reaction based on the jet of the machining fluid.

Abstract: In an arrangement of the present invention, a connecting member is coupled with a belt attached to a saddle, and then a table is arranged on the saddle so that both ends thereof on its underside are connected with both ends of the connecting member. Thus, all the parts are connected with each other without being interfered with by the saddle or the like.