Abstract: Adhesives prepared by dissolving polyvinyl alcohol, a filler and a water-soluble boron compound in water are described. These adhesives are "cold-set" adhesives which are liquid at a temperature of 60.degree. C. or more, but lose their fluidity to gelatinize on cooling at a temperature higher than 20.degree. C., they are very useful for a cold corrugation system.
Type:
Grant
Filed:
April 8, 1982
Date of Patent:
April 10, 1984
Assignees:
Unitika Ltd., Okayama Paper Mill Co., Ltd.