Patents Assigned to Oki Electric Industry, Co.
  • Publication number: 20230420427
    Abstract: A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.
    Type: Application
    Filed: May 19, 2023
    Publication date: December 28, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Akihiro IINO, Toru KOSAKA, Hironori FURUTA, Genichirou MATSUO, Shinya JUMONJI, Hiroto KAWADA, Yuuki SHINOHARA
  • Patent number: 11853001
    Abstract: A development device may include: a development device body; a developer cartridge detachably attached to the development device body; first and second levers provided to the development device body, the first lever including an operation part and a first engagement portion and the second lever including a second engagement portion; first and second engaged portions provided to the developer cartridge, the first engaged portion being configured to form a first engagement with the first engagement portion and the second engaged portion being configured to form a second engagement with the second engagement portion; and a first biasing member biasing the first engagement portion to the first engaged portion. When the operation part is operated with a first pressing force, the first engagement is released, and when the operation part is operated with a second pressing force greater than the first pressing force, the first and second engagements are released.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: December 26, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Junichi Ushikubo, Yuuki Kobayashi
  • Patent number: 11856173
    Abstract: An information processing method to be performed by an information processing apparatus according to an embodiment may include: causing an authentication processor to perform a login authentication based on an operation performed on an operation section; and causing an exclusive control executor that gives a usage right to use a function to the operation section after the operation section is authenticated by the login authentication and releases the usage right given to the operation section in a case where no response is received from the operation section for a predetermined time after the usage right is given to determine, based on a detection result by a status detector that detects a status of the information processing apparatus, whether or not to release the usage right given to the operation section after the predetermined time passes.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: December 26, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Daitetsu Amada
  • Patent number: 11837042
    Abstract: A medium processing device includes a first, second and third conveyance path, a classification section, a first, second and third switching unit, a first, second and third storage box and a controller. Each of the first, second and third conveyance paths has two ends. One end of the first conveyance path is connected to one end of the third conveyance path. One end of the second conveyance path is connected to the other end of the third conveyance path at a second side of the classification section opposite to the first side. The other end of the first conveyance path is connected to the other end of the second conveyance path. The controller controls the first conveyance path and the second conveyance path so that the first and second conveyance paths are driven independently from each other.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: December 5, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Madoka Wakabayashi, Hayato Shimizu
  • Publication number: 20230375957
    Abstract: An image formation apparatus according to an embodiment may include: an image formation section to form an image with a developer; an entire area printing rate calculator configured to calculate an entire area printing rate, which is, a printing rate of an entirety of an image formation area; a divided area printing rate calculator configured to calculate each divided area printing rate, which is, a printing rate of each of plural divided areas, divided in a main scanning direction, of the image formation area; and a deteriorated developer discarding operation execution section configured, when the entire area printing rate is equal to or lower than an entire area printing rate threshold, to perform a deteriorated developer discarding operation to discard the developer in any one of the divided areas in which the divided area printing rate is equal to or lower than a divided area printing rate threshold thereof.
    Type: Application
    Filed: May 8, 2023
    Publication date: November 23, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Fumitaka OZEKI, Hisashi SOGA
  • Patent number: 11825264
    Abstract: To perform an efficient and stable area sound pick-up process. The present invention relates to a sound pick-up apparatus.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 21, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Kazuhiro Katagiri
  • Patent number: 11822274
    Abstract: A fixing device includes an annular belt having an outer circumferential surface, and a facing member that faces the outer circumferential surface of the annular belt to form a nip region. The annular belt is configured so that in measurement of a hardness of the outer circumferential surface using a hardness tester, a ratio (A/B) of a first hardness value (A) to a second hardness value (B) is 0.738 or more and 0.837 or less. The first hardness value (A) represents a measured value at a time when a measurement time corresponding to a time required for a predetermined point on the outer circumferential surface to pass through the nip region has elapsed after start of the hardness measurement. The second hardness value (B) represents a measured value at a time when the measured value by the hardness tester is saturated.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: November 21, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yoshihiro Kanno
  • Patent number: 11809103
    Abstract: An image formation apparatus according to one or more embodiments may include: an apparatus main body that includes an image formation section configured to form an image on a medium; a fixation device that includes a fixation member configured to heat the medium and is attachable to the apparatus main body in a first direction; and a temperature detector including a lens, provided in the apparatus main body, and configured to detect a temperature of the fixation member through the lens. An optical axis of the lens is inclined with respect to the first direction.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: November 7, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Hiroki Ishikura
  • Patent number: 11804094
    Abstract: While a bill controller is moving a bill press and a pool guide from accumulation positions to delivery positions, a time period from a time point to a time point for moving both the bill press and the pool guide and a time period from the time point to a time point for moving only the pool guide are given.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: October 31, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Yoichi Nakaoka, Toru Nagaoka, Madoka Wakabayashi
  • Patent number: 11796352
    Abstract: To uniquely determine a Brillouin frequency shift (BFS) even if a relation between phase and intensity of an intensity signal corresponding to a phase difference between the two optical paths in an interferometer varies.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: October 24, 2023
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Kengo Koizumi
  • Publication number: 20230320224
    Abstract: A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.
    Type: Application
    Filed: March 6, 2023
    Publication date: October 5, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Hironori FURUTA, Toru KOSAKA, Takahito SUZUKI, Kenichi TANIGAWA, Takuma ISHIKAWA, Yutaka KITAJIMA
  • Publication number: 20230320228
    Abstract: A piezoelectric film integrated device includes a substrate; an electrode provided on the substrate; a first piezoelectric element that is provided on the electrode and includes a first monocrystalline piezoelectric film and a first electrode film superimposed on the first monocrystalline piezoelectric film; and a second piezoelectric element that is provided on the first piezoelectric element and includes a second monocrystalline piezoelectric film and a second electrode film superimposed on the second monocrystalline piezoelectric film.
    Type: Application
    Filed: March 7, 2023
    Publication date: October 5, 2023
    Applicants: Oki Electric Industry Co., Ltd., I-PEX Piezo Solutions Inc.
    Inventors: Hironori FURUTA, Toru KOSAKA, Takahito SUZUKI, Kenichi TANIGAWA, Takuma ISHIKAWA, Yutaka KITAJIMA, Akio KONISHI, Hiroaki KANAMORI, Takeshi IIZUKA
  • Publication number: 20230320219
    Abstract: A piezoelectric film integrated device include a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate; a first monocrystalline piezoelectric film provided on the first electrode; a second monocrystalline piezoelectric film provided on the second electrode and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film; a third electrode provided on the first monocrystalline piezoelectric film; and a fourth electrode provided on the second monocrystalline piezoelectric film.
    Type: Application
    Filed: March 6, 2023
    Publication date: October 5, 2023
    Applicants: Oki Electric Industry Co., Ltd., I-PEX Piezo Solutions Inc.
    Inventors: Hironori FURUTA, Toru KOSAKA, Takahito SUZUKI, Kenichi TANIGAWA, Takuma ISHIKAWA, Yutaka KITAJIMA, Akio KONISHI, Hiroaki KANAMORI, Takeshi IIZUKA
  • Publication number: 20230320217
    Abstract: A piezoelectric-body film joint substrate includes a substrate, a substrate electrode provided on the substrate, a first piezoelectric-body film stuck on the substrate electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, and a second piezoelectric-body film stuck on the first upper electrode film and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film.
    Type: Application
    Filed: March 9, 2023
    Publication date: October 5, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Hironori FURUTA, Toru KOSAKA, Takahito SUZUKI, Kenichi TANIGAWA, Takuma ISHIKAWA, Yutaka KITAJIMA
  • Publication number: 20230305464
    Abstract: A fixing device includes an annular belt having an outer circumferential surface, and a facing member that faces the outer circumferential surface of the annular belt to form a nip region. The annular belt is configured so that in measurement of a hardness of the outer circumferential surface using a hardness tester, a ratio (A/B) of a first hardness value (A) to a second hardness value (B) is 0.738 or more and 0.837 or less. The first hardness value (A) represents a measured value at a time when a measurement time corresponding to a time required for a predetermined point on the outer circumferential surface to pass through the nip region has elapsed after start of the hardness measurement. The second hardness value (B) represents a measured value at a time when the measured value by the hardness tester is saturated.
    Type: Application
    Filed: December 16, 2022
    Publication date: September 28, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Yoshihiro KANNO
  • Publication number: 20230305462
    Abstract: A fixation device according to an embodiment may include: an annular belt, and includes an elastic layer with a thickness of more than 300 ?m; and a counter member opposed to the outer peripheral surface of the annular belt to form a nip region with the annular belt. A difference between a local maximum and a local minimum in a film thickness profile of the annular belt along a circumferential direction of the outer peripheral surface at a first location in a width direction of the annular belt is less than 101 ?m.
    Type: Application
    Filed: January 16, 2023
    Publication date: September 28, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Tomomi OOTAKA
  • Publication number: 20230305436
    Abstract: A developer container includes: a container body that stores developer; an agitating member that is rotatably disposed in the container body and rotates to agitate the developer; a first swing member that includes a first fixed end, a first free end, a first surface, and a second surface opposite the first surface, and that is swung by the agitating member coming into contact with the first surface when the agitating member rotates; and a projecting support that is disposed to face the second surface and project from a wall surface formed in the container body, and that abuts the second surface.
    Type: Application
    Filed: January 6, 2023
    Publication date: September 28, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Kaori SUDO
  • Publication number: 20230305465
    Abstract: A fixation device according to an embodiment may include: an annular belt including an elastic layer with a thickness of more than 300 ?m; and a counter member opposed to an outer peripheral surface of the annular belt to form a nip region with the annular belt. A ratio (A/B) of a first hardness value (A) to a second hardness value (B) of the outer peripheral surface of the annular belt is 0.566 or more, where the first hardness value is measured, in hardness measurement using a hardness meter, at a time when a passage time, which is a time it takes for a certain point of the outer peripheral surface to pass through the nip region, has just passed from the start of the hardness measurement, and the second hardness value is measured at a time when the measured value of the hardness meter has just been saturated.
    Type: Application
    Filed: January 18, 2023
    Publication date: September 28, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Akira UBAGAI
  • Publication number: 20230288232
    Abstract: To uniquely determine a Brillouin frequency shift (BFS) even if a relation between phase and intensity of an intensity signal corresponding to a phase difference between the two optical paths in an interferometer varies.
    Type: Application
    Filed: October 17, 2022
    Publication date: September 14, 2023
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Kengo KOIZUMI
  • Patent number: D1009988
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: January 2, 2024
    Assignee: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventors: Tetsu Koyama, Yoshihiro Goto, Hisatoshi Saito, Shingo Shimada, Akira Saito, Hiroki Haruyama