Patents Assigned to Okitsumo Incorporated
  • Patent number: 10673106
    Abstract: A device of the present disclosure includes an electronic component, a metal plate, a housing, and a wavelength selective heat radiating member. The metal plate is thermally coupled to the electronic component. The housing houses the electronic component and the metal plate. The wavelength selective heat radiating member is mounted on a surface of the metal plate, so as to face an inner side surface of a specific portion of the housing. The wavelength selective heat radiating member is configured to convert thermal energy from the electronic component into heat radiation having a wavelength that penetrates the specific portion of the housing, and emit the heat radiation toward the inner side surface of the specific portion of the housing.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: June 2, 2020
    Assignees: MAKITA CORPORATION, OKITSUMO INCORPORATED
    Inventors: Hitoshi Suzuki, Takashi Toyonaga, Naoshi Kimura
  • Publication number: 20180102575
    Abstract: A device of the present disclosure includes an electronic component, a metal plate, a housing, and a wavelength selective heat radiating member. The metal plate is thermally coupled to the electronic component. The housing houses the electronic component and the metal plate. The wavelength selective heat radiating member is mounted on a surface of the metal plate, so as to face an inner side surface of a specific portion of the housing. The wavelength selective heat radiating member is configured to convert thermal energy from the electronic component into heat radiation having a wavelength that penetrates the specific portion of the housing, and emit the heat radiation toward the inner side surface of the specific portion of the housing.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 12, 2018
    Applicants: MAKITA CORPORATION, OKITSUMO INCORPORATED
    Inventors: Hitoshi SUZUKI, Takashi TOYONAGA, Naoshi KIMURA
  • Patent number: 9520335
    Abstract: An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity wall defining each microcavity is suppressed or in which microcavities each having an aspect ratio larger than 3.0 are formed. For the wavelength selective heat radiation material, a base material having a mask having predetermined openings tightly adhered to a surface thereof, or a base material in which depressions are previously formed on one surface thereof by pressing a die having projections arrayed so as to correspond to positions of microcavities thereagainst, is subjected to anisotropic etching, thereby providing a wavelength selective heat radiation material in which the surface roughness of the upper portion of the cavity wall defining each of the microcavities is suppressed or a wavelength selective heat radiation material having microcavities whose each aspect ratio is larger than 3.0.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: December 13, 2016
    Assignees: TOKYO METROPOLITAN UNIVERSITY, OKITSUMO INCORPORATED
    Inventors: Hideki Masuda, Toshiaki Kondo, Takashi Toyonaga, Naoshi Kimura, Fumitaka Yoshioka
  • Publication number: 20160260649
    Abstract: An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity wall defining each microcavity is suppressed or in which microcavities each having an aspect ratio larger than 3.0 are formed. For the wavelength selective heat radiation material, a base material having a mask having predetermined openings tightly adhered to a surface thereof, or a base material in which depressions are previously formed on one surface thereof by pressing a die having projections arrayed so as to correspond to positions of microcavities thereagainst, is subjected to anisotropic etching, thereby providing a wavelength selective heat radiation material in which the surface roughness of the upper portion of the cavity wall defining each of the microcavities is suppressed or a wavelength selective heat radiation material having microcavities whose each aspect ratio is larger than 3.0.
    Type: Application
    Filed: April 2, 2015
    Publication date: September 8, 2016
    Applicants: Tokyo Metropolitan University, Okitsumo Incorporated
    Inventors: Hideki MASUDA, Toshiaki KONDO, Takashi TOYONAGA, Naoshi KIMURA, Fumitaka YOSHIOKA
  • Patent number: 8524325
    Abstract: A method of producing a photocatalytic coating material which includes: the steps of coating the surface of a base material having hydrophobic substances on its surface with a photocatalytic coating material including at least (a) photocatalytic oxide particles, (b) a hydrophobic-resin emulsion, (c) water, and (d) silica particles, and hardening the coated material. The average sizes of the ingredient (a) and the ingredient (d) are smaller than that of the emulsified particles of the hydrophobic resin dispersed in the ingredient (b), ingredient (a) constitutes 1 to <5% by weight of the total solid matter of the coating material, ingredient (d) constitutes 1 to 90% by weight of a total solid matter of the coating material, and once the coating material is applied onto a base material, the photocatalytic oxide particles and the silica particles move upward and a coating film 1 ?m to 1 mm thick is formed.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: September 3, 2013
    Assignees: Toto Ltd., JHCC Ltd., Okitsumo Incorporated
    Inventors: Kazuo Takahashi, Akira Shimai, Mitsuhide Shimohigoshi, Norio Sendoda, Tatsuhiko Kuga, Koji Okubo, Kazumasa Okita
  • Publication number: 20090226620
    Abstract: A method of producing a photocatalytic coating material which includes: the steps of coating the surface of a base material having hydrophobic substances on its surface with a photocatalytic coating material including at least (a) photocatalytic oxide particles, (b) a hydrophobic-resin emulsion, (c) water, and (d) silica particles, and hardening the coated material. The average sizes of the ingredient (a) and the ingredient (d) are smaller than that of the emulsified particles of the hydrophobic resin dispersed in the ingredient (b), ingredient (a) constitutes 1 to <5% by weight of the total solid matter of the coating material, ingredient (d) constitutes 1 to 90% by weight of a total solid matter of the coating material, and once the coating material is applied onto a base material, the photocatalytic oxide particles and the silica particles move upward and a coating film 1 ?m to 1 mm thick is formed.
    Type: Application
    Filed: May 11, 2009
    Publication date: September 10, 2009
    Applicants: Toto Ltd.- 84%, JHCC Ltd. -13%, Okitsumo Incorporated - 3%
    Inventors: Kazuo Takahashi, Akira Shimai, Mitsuhide Shimohigoshi, Norio Sendoda, Tatsuhiko Kuga, Koji Okubo, Kazumasa Okita
  • Patent number: 6861467
    Abstract: A powder coating composition contains a binder component of either a silicone resin or a mixture of a silicone resin and at least one selected from the group consisting of an epoxy resin, a phenolic resin, an acrylic resin, a polyester resin, and a fluororesin; and a reinforcing pigment of at least one of a mica and a whisker, wherein the content of the silicone resin in the binder component is at least 60% by weight. Such a composition can be free from the occurrence of the paint film cracks and peeling under heat at a high temperature of 300° C. or higher and can have good heat-resistant adhesion. Therefore, the present invention provides a powder coating composition which is excellent in heat-resistant adhesion at a high temperature of 300° C.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: March 1, 2005
    Assignee: Okitsumo Incorporated
    Inventor: Hiroshi Nakano
  • Patent number: 6083612
    Abstract: A heat resistant, mold releasing coating characterized in: (a) that it comprises a layer A formed to cover the surface of the base material to be coated, wherein the coating layer forming components thereof comprise 20 to 95% by weight of frit and 5 to 80% by weight of at least one heat resistant resin selected from the group consisting of fluoro resins, silicon based resins, aromatic polysulfone resins, poly(phenylenesulfide) resins, polyamideimide resins and polyimide resins, and (b) that it comprises a layer B formed to cover the surface of said layer A, wherein the coating layer forming components thereof comprise 20 to 100% by weight of one or more fluoro resins, 0 to 20% by weight of frit, and 0 to 80% by weight of at least one heat resistant resin selected from the group consisting of silicon based resins, aromatic polysulfone resins, poly(phenylenesulfide) resins, polyamideimide resins and polyimide resins.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: July 4, 2000
    Assignee: Okitsumo Incorporated
    Inventor: Kazumasa Okita
  • Patent number: 5183656
    Abstract: A deodorant comprising an organosilicon as binder and a metal oxide or salt of at least one member selected from the group consisting of titanium, zirconium, lanthanum and manganese.
    Type: Grant
    Filed: August 2, 1991
    Date of Patent: February 2, 1993
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Okitsumo Incorporated
    Inventors: Kazuo Uesaka, Kazumasa Okita, Tsutomu Arai
  • Patent number: 5082386
    Abstract: Disclosed is an aqueous emulsion of tacky acrylic resins packaged in a felt pen type container/applicator for use as a paper adhesive for stationery purposes, which emulsion forms a film of the resin on a sheet of paper when applied thereto by the selective absorption of water by the paper almost instantaneously which film is capable of bonding another sheet of paper to the sheet to which the film is applied with an initial adhesion strength equal to or greater than the strength of the paper.
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: January 21, 1992
    Assignee: Okitsumo Incorporated
    Inventors: Bungo Hironaka, Fumitaka Yoshioka