Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

Abstract: An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.

Abstract: The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

Abstract: An object of the present invention is to provide a treatment liquid and a treatment method that are capable of enhancing the corrosion resistance of a net material. This object is achieved by, after forming a chemical conversion treatment film on the surface of a metal material, forming a film using a film-forming treatment liquid, the treatment liquid comprising: a silicon compound containing at least one member selected from the group consisting of alkoxysilyl, alkoxysilylene, and a siloxane bond; an organometallic compound; and water.

Abstract: The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.

Abstract: Provided are a black mixed oxide that contains chromium per se of any valency as a main component, and fails to contain cobalt as the main component material, and has a high safety, an excellent color tone and economical efficiency, and a method for producing the same, and various products using the black mixed oxide material. The mixed oxides comprise oxides containing La, Mn and Cu as main components but containing neither Cr nor Co as a main component, wherein the contents of La, Mn and Cu in the mixed oxides satisfy the following ratios, as oxide equivalent amount with respect to 100% by weight of the oxide equivalent amount: the La content as La2O3 being 35-70 wt %; the Mn content as MnO2 being 25-60 wt %; and the Cu content as CuO being 0.5-10 wt %.

Abstract: Provided are a black mixed oxide that contains chromium per se of any valency as a main component, and fails to contain cobalt as the main component material, and has a high safety, an excellent color tone and economical efficiency, and a method for producing the same, and various products using the black mixed oxide material. The mixed oxides comprise oxides containing La, Mn and Cu as main components but containing neither Cr nor Co as a main component, wherein the contents of La, Mn and Cu in the mixed oxides satisfy the following ratios, as oxide equivalent amount with respect to 100% by weight of the oxide equivalent amount: the La content as La2O3 being 35-70 wt %; the Mn content as MnO2 being 25-60 wt %; and the Cu content as CuO being 0.5-10 wt %.

Abstract: The present invention provides a sealing treatment solution free from a nickel salt. The sealing treatment solution is capable of ensuring a sealing performance comparative to that in the method using a sealing treatment solution containing a nickel salt, and ensuring that the resulting sealing-treated anodic oxide film has excellent contamination resistance. The present invention provides a sealing treatment solution for anodic oxide film of aluminum alloy, the sealing treatment solution comprising a metal salt, a pH buffer, and a surfactant, the metal salt being at least one member selected from alkali metal salts and alkaline-earth metal salts.

Abstract: This invention relates to a coating formation composition and a metal material treatment method that are capable of forming a laminate coating in which a chemical conversion coating and a surface treatment coating are laminated by applying and heating the composition on the surface of the metal material, without performing a chemical conversion treatment on the metal material separately from the surface treatment, and that are capable of imparting excellent rust prevention properties to the metal material. The invention provides a coating formation composition comprising an alkoxysilane oligomer, a metal salt, and a solvent, the solvent being water and/or a water-soluble organic solvent, and the metal salt being contained in an amount of 0.1 to 30 parts by mass per 100 parts by mass of the alkoxysilane oligomer.

Abstract: An object is to provide a novel composition for blackening treatment that can sufficiently blacken copper circuits of printed wiring boards, circuits made of silver paste, and other various articles containing a copper-based metal, such as copper or a copper alloy, or a silver-based metal, such as silver or a silver alloy, without impairing the smoothness of the copper-based metal or silver-based metal.

Abstract: An object of the present, invention is to provide a chemical conversion surface, treatment solution, that is capable of forming a chemical conversion film with excellent corrosion resistance and designability on articles having aluminum or aluminum alloy surfaces by using steps similar to those of known chemical conversion treatments without using hexavalent chromium, trivalent chromium, fluorine, or other components that create a significant burden on the environment. The present invention relates to a chemical conversion treatment solution for aluminum or aluminum alloys, comprising an alkaline aqueous solution containing a permanganic acid compound and at least one metal oxygen acid compound selected from the group consisting of vanadic acid compounds, molybdic acid compounds, tungstic acid compounds, zirconic acid compounds, and niobic acid compounds.

Abstract: This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C2-5 aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a —COOM group, wherein M is hydrogen, an alkali metal, or a —NH4 group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.

Abstract: An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

Abstract: The present invention provides a blackening treatment method for a black Cr—Co alloy plating film, the method comprising bringing a black Cr—Co alloy plating film having a Cr content of 1 to 15 wt. % into contact with a blackening treatment solution comprising an aqueous solution with a pH value of ?1 to 5. According to the present invention, the blackish color of a less blackish plating film formed from a plating bath containing trivalent chromium is enhanced to further improve decorativeness. Furthermore, the corrosion resistance of the film can be more improved by performing electrolytic chromate treatment after blackening treatment.

Abstract: An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.

Abstract: An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): R—(CH2)l—S—(CH2)m—S—(CH2)n—R??(1), wherein R is H, OH, or SO3Na, and l, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.

Abstract: The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

Abstract: The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and (3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L. The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.

Abstract: An object of the present invention is to provide multilayer plating film with excellent corrosion resistance. The present invention provides a multilayer plating film containing at least a chrome plating film and a tin-nickel plating film, the chrome plating film being the outermost layer, and the tin-nickel plating film being formed below the chrome plating film by using an acidic tin-nickel alloy plating solution containing a divalent tin compound, a nickel compound, a triamine compound, and a fluoride.