Abstract: A method of manufacturing an ultrasound transducer for an ultrasound imaging device including a plurality of transducer elements arranged in a two dimensional array on a single carrier of semi-conductor material including the step of providing a buffer layer between the carrier and a layer including piezo electrical material, the buffer layer having a thickness arranged for dicing each of the plurality of transducer elements on the carrier.

Abstract: A method of manufacturing an ultrasound transducer for an ultrasound imaging device including a plurality of transducer elements arranged in a two dimensional array on a single carrier of semi-conductor material including the step of providing a buffer layer between the carrier and a layer including piezo electrical material, the buffer layer having a thickness arranged for dicing each of the plurality of transducer elements on the carrier.

Abstract: Described herein is an ultrasound probe for ultrasound imaging using contrast enhancing agents and including two interleaved arrays of transducer elements. Each array has a longitudinal dimension along which transducer elements are placed. One interleaved array includes transducer elements having a lower center frequency. Another interleaved array includes transducer elements having a higher center frequency. The transducer elements are provided on inter-fitting support members. A length of the transducer elements of one array is larger than a corresponding length of the transducer elements of the other array.