Abstract: The present invention relates to heteroleptic complexes comprising a phenylimidazole or phenyltriazole unit bonded via a carbene bond to a central metal atom, and phenylimidazole ligands attached via a nitrogen-metal bond to the central atom, to OLEDs which comprise such heteroleptic complexes, to light-emitting layers comprising at least one such heteroleptic complex, to a device selected from the group consisting of illuminating elements, stationary visual display units and mobile visual display units comprising such an OLED, to the use of such a heteroleptic complex in OLEDs, for example as emitter, matrix material, charge transport material and/or charge blocker.

Abstract: An LED device comprises a substrate and a stack of layers defining an LED component and including an electroluminescent layer. A capacitive structure is formed on top of the stack of layers. The area of the defined capacitor encodes information concerning the electrical characteristics of the LED component.

Abstract: An electronic device is provided in which a dedicated area of the device substrate is patterned to form a resistive track so that it can be contacted by a readout arrangement. The resistive track is used to encode information. The information is provided to a driver which can then derive information about the type of device being driven. The driver can thus be controlled accordingly.

Abstract: The invention relates to a voltage-light conversion device (1) like an OLED comprising a structured electrically conducting layer (3) on a substrate (2) and a further layer (60) that is part of an encapsulation and which comprises a layer edge (63). The electrically conducting layer comprises in an edge region (70) close to the layer edge a structure edge (10), wherein at least a part of the structure edge is not perpendicular to the layer edge. Since in the edge region at least a part of the structure edge is not perpendicular to the layer edge, during the production process for producing the further layer a possible flow of initially liquid layer material along the structure edge can be directed such that the liquid material remains relatively close to the desired layer edge, i.e. the liquid material can be better locally confined.

Abstract: A socket is provided (100, 400) for electrically connecting an OLED blade (300), the socket (100, 400) comprising a first part (110, 410) and a second part (120, 420) with a slot (170, 470) between the first part (110, 410) and the second part (120, 420) for receiving the OLED blade (300), at least parts of the first part (110, 410) or the second part (120, 420) being transparent such that primary light emitted by the OLED blade (300) when inserted in the slot can pass the first part (110, 410) or the second part (120, 420), the socket (100, 400) further comprising first electrical contacts (150) for electrically contacting the OLED blade (300) and a first mechanical fixture (140) to attach the OLED blade (300) in a removable way between the first part (110, 410) and the second part (120, 420), the socket (100, 400) further comprising an electrical connector (130, 430) for supplying electrical power to the first electrical contacts (150).

Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

Abstract: A device and associated PCB structure are provided in which a dedicated area of the device substrate is patterned, so that it can be contacted by a readout arrangement of the PCB. The pattern comprises an arrangement of contact regions. Interconnections and open circuits are used to encode information. A dotted contact area of the PCB is used to probe the pattern, and relay this to a driver which can then derive information about the type of device being driven. The driver can thus be controlled accordingly.

Abstract: The invention relates to a light-emitting device like an OLED comprising a light emission region between an anode (5) and a cathode (6). An alternating arrangement (9) of anode pads (11) for electrically connecting the anode and cathode pads (10) for electrically connecting the cathode and an encapsulation (8) are configured such that the anode and cathode pads are electrically connectable by straight anode and cathode electrical connectors (3, 4) through openings (12) of the encapsulation. The alternating arrangement of the anode and cathode pads can lead to a more homogenous electrical field between the anode and the cathode and therefore allows for an improved degree of homogeneity of light emission. More, since the alternating arrangement of the anode and cathode pads is connectable by corresponding straight connectors, the contacting of the pads can be performed technically relatively easily.

Abstract: An electrical circuit is described for detection of an electrical hazard condition of a load 20, in particular of an OLED lighting element comprising driving terminals A, C. An electrical hazard condition, such as an overvoltage or short circuit is to be detected between terminals 22a, 22b of the circuit. A disabling element 24 is connected to one of the terminals 22a, 22b to disable the load. A monitoring circuit is connected to monitor a voltage V or current magnitude at at least one of the terminals 22a, 22b. The monitoring circuit comprises a maximum or minimum value detector 26 to deliver a maximum or minimum value Vmax of the voltage or current magnitude over time. The monitoring circuit is disposed to monitor the maximum or minimum value Vmax to detect the electrical hazard condition. A monitoring circuit is connected to activate the disabling element 24 if an electrical hazard condition is detected.

Abstract: A short detection circuit is provided for detecting a short circuit condition of an LED. A voltage threshold is set which is dependent on the LED operating current, such that there are at least two different voltage thresholds at two different LED operating currents. This means false detections can be reduced and the LED current operating range can be increased over which the short detection functions.

Abstract: The invention relates to a light source (1) comprising a light generating unit (2) like an organic light emitting diode and an outcoupling device (3) for coupling light out of the light generating unit in an outcoupling direction (4). The outcoupling device comprises a first region (5) for facing the light generating unit, a second region (7) having a refractive index being smaller than the refractive index of the first region, and a structured intermediate region (6) between the first region and the second region. The first region is optically homogenous and has a thickness in the outcoupling direction being larger than a coherence length of the light, thereby reducing generally possible wavelength dependent interference effects and, thus, a corresponding degradation of the outcoupling efficiency. The outcoupling efficiency can therefore be increased.

Abstract: An electronic device is provided in which a dedicated area of the device substrate is patterned to form a resistive track so that it can be contacted by a readout arrangement. The resistive track is used to encode information. The information is provided to a driver which can then derive information about the type of device being driven. The driver can thus be controlled accordingly.

Abstract: The present invention relates to an MID device (51) comprising an OLED (52) and a short detection circuit (53) for detection a short in the OLED (52). The short detection circuit (53) comprise a temperature sensing unit (55) tar sensing a first and a second temperature of the OLED (52) and a short detection unit (56) kw detecting the short based on a difference between the first and the second temperature. Therewith, the short detection can be less sensitive with respect to production tolerances resp. OLED binning.

Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

Abstract: A device and associated PCB structure are provided in which a dedicated area of the device substrate is patterned, so that it can be contacted by a readout arrangement of the PCB. The pattern comprises an arrangement of contact regions. Interconnections and open circuits are used to encode information. A dotted contact area of the PCB is used to probe the pattern, and relay this to a driver which can then derive information about the type of device being driven. The driver can thus be controlled accordingly.

Abstract: The invention relates to supervision circuits (10) for supervising organic light emitting diode devices (1) via detection circuits (20) for detecting failure states of the organic light emitting diode devices (1) and for generating decision signals in response to detected failure states of the organic light emitting diode devices (1), which detected failure states have durations equal to or larger than time intervals. In response to the decision signals, the organic light emitting diode devices (1) can be bypassed and deactivated through switching circuits (30) such as bi-stable circuits. The failure states may include that the organic light emitting diode devices (1) have a relatively low impedance or “short” and a relatively high impedance or “open”. The supervision circuit (10) further prevents the organic light emitting diode devices (1) from being bypassed unjustly.

Abstract: The present invention relates to silyl- and heteroatom-substituted compounds selected from carbazoles, dibenzofurans, dibenzothiophenes and disilylbenzophospholes of the formula (I) or (I*), to the use of the compounds of the formula (I) or (I*) in organic electronics applications, preferably in organic light-emitting diodes, to an organic light-emitting diode comprising at least one compound of the formula (I) or (I*), to a light-emitting layer comprising at least one compound of the formula (I) or (I*), to a blocking layer for holes/excitons comprising at least one compound of the formula (I) or (I*), and to an apparatus selected from the group consisting of stationary visual display units, mobile visual display units, illumination units, keyboards, items of clothing, furniture and wallpaper, comprising at least one inventive organic light-emitting diode.

Abstract: The invention relates to an illuminant (23) and a socket (20) for a lamp (15). The features of the socket can be implemented also independently of the features of the illuminant (23). The socket has supply terminal areas on multiple sides of the socket housing such that the socket (20) can be selectively supplied with electricity and wired from different sides or also simultaneously from multiple sides. Independently of the number and the arrangement of the supply terminal areas (94), multiple electrical supply terminals (95) having the same polarity are provided on the socket (20). Said supply terminals (95) having the same polarity are electrically short-circuited by means of a shorting connector (116), in particular two identical shorting connectors (116) being arranged in the socket housing. Said socket (20) and illuminant (23) modularly achieve large total illumination surfaces in a lamp (15) and an appealing appearance in a very simple manner.

Abstract: The present invention relates to a method of manufacturing a light emitting device with improved internal out-coupling by providing an intermediate layer (11) with a modulated surface. This is achieved by exposure of a flat glass surface (100) to a saturated etching fluid or by providing local changes in the chemical surface composition of the glass substrate or by depositing locally separated sub-?m particles. By removal of the etching fluid, either ultrafine particles (12) are deposited or defects are generated consisting of glass component areas of sub^m-size extension with a high sticking coefficient with respect to the species deposited later on from the gas phase.

Abstract: The invention relates to an electroluminescent lighting device, which is based on an array of standard electroluminescent tiles (D1-Dn) combined with an array of ballast components (R1-Rn) mounted on a carrier board (30) in such a way that the power loss is evenly spread across the whole board area to minimize local electric power in the ballast components. The unavoidable remaining hot spots and electroluminescent tiles are thermally coupled in such a way that the additional thermal load on the electroluminescent emission layer is as symmetric as possible with respect to the self heating of the electroluminescent device. This can be achieved by a combination of properly designed heat spreading and thermal isolation of the electroluminescent and ballast components. Heat spreading is achieved by a properly designed interconnection structure (40) on the carrier board. Different options are proposed to thermally isolate the electroluminescent tiles from the hot spots.