Abstract: A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Abstract: The present invention is directed to a lead-free, nontoxic pyrotechnic composition, comprising: 30-80 wt % of bismuth subnitrate; and 10-50 wt % of a fuel, wherein all weight percents are based on the total weight of the composition. The present invention is also directed to a lead-free, nontoxic priming composition, comprising: 20-80 wt % of the above nontoxic pyrotechnic composition; 20-50 wt % of an initiator explosive; and 2-10 wt % of a sensitizer, wherein all weight percents are based on the total weight of the composition.

Abstract: The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions, manganese ions, vanadium ions, iron ions, tin ions, indium ions, silver ions, and combinations thereof; and optionally, an electrolyte that does not contain potassium or sodium ions; wherein the treatment composition is substantially free of chromium, and wherein the treatment composition forms a coating on a substrate or material that enhances adhesion of a polymer to the material. The present invention is also directed to materials coated with the above treatment composition, and methods of coating materials using the above composition.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: A bullet includes a frontward facing aperture. Contained within the aperture is a relatively hard bullet frontal element that provides advantageous bullet impact performance. In one embodiment, the frontal element is a steel sphere that provides advantageous penetration and weight retention when the bullet impacts laminated glass, such as an automobile windshield.

Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A plastic, cup-shaped, multi-petal sabot housing a sub-caliber projectile for use such as in shotgun cartridges. The sabot engages the rifling of the shotgun barrel and transfers the spin to the projectile. A reinforcement disk is advantageously at least partially embedded in a sabot base and has a central aperture and a plurality of additional apertures. Sabot base material extends through the additional apertures. Advantageously, in its relaxed condition, each sabot petal includes a protrusion from its inboard surface for engaging a projectile ogive. The protrusion and its contact area with the projectile are fractions of the local petal width.

Abstract: The present invention is directed to a water-based adhesive composition, comprising an admixture of: (A) about 5 to about 80 wt % of an aqueous polyester polyurethane dispersion; and (B) about 95 to about 20 wt % of an aqueous aliphatic polyurethane dispersion. The present invention is also directed to a method of adhering a workpiece or adherent to a substrate using the above water-based adhesive composition.

Abstract: A copper foil for lamination to a dielectric substrate is coated with a laser ablation inhibiting layer having an average surface roughness (Rz) of less than 1.0 micron and an average nodule height of less than 1.2 micron that is effective to provide a lamination peel strength to FR-4 of at least 4.5 pounds per inch. The coated foil further has a reflectivity value of at least 40. The coated foil is typically laminated to a dielectric substrate, such as glass reinforced epoxy or polyimide and imaged into a plurality of circuit traces. Blind vias may be drilled through the dielectric terminating at an interface between the foil and the dielectric. The coated foil of the invention resists laser ablation, thereby resisting piercing of the foil by the laser during drilling.

Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.

Abstract: A projectileless ammunition system (20; 320) includes a metallic case (22; 322). A propellant charge (26; 326) is carried by the case and cover by an over-powder member (24; 324) in the absence of a separate projectile. The ammunition is advantageously used with an industrial ballistic tool operating so that each spent case serves as the effective projectile to be propelled by firing of the next round of ammunition.

Abstract: The present invention is directed to a lead-free, non-toxic priming composition, comprising: 20-40 wt % of a dinitrobenzofuroxan salt; 2-10 wt % of a sensitizer; 0-30 wt % of an oxidizer; and 45-70 wt % of an abrasive, wherein all weight percents are based on the total weight of said composition.

Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850° C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Abstract: A process for removing chlorine gas from the tail gas stream of a chlor/alkali plant or other chemical processes comprising the steps of: (a) contacting a chlorine-, hydrogen-, and carbon dioxide-containing tail gas stream with a zeolite molecular sieve having a molecular pore diameter greater than the molecular diameter of the carbon dioxide and hydrogen and smaller than the molecular diameter of chlorine so that at least a portion of the carbon dioxide is absorbed onto the molecular sieve, and thereby producing a purified tail gas stream that contains substantially all of the chlorine and hydrogen values and a reduced amount or no amount of carbon dioxide values; and (b) contacting the purified tail gas stream with an aqueous sodium hydroxide scrubbing solution in order to remove substantially all of the chlorine values from the purified tail gas stream, whereby producing a purified sodium hypochlorite solution that is substantially free of sodium carbonate.

Abstract: A package for encasing one or more semiconductor devices includes a composite base component with opposing first and second surfaces formed from a mixture of metallic powders. A first metallic powder is copper or a copper-base alloy and a second metallic powders is a metal or metal alloy with a coefficient of thermal expansion less than that of copper. There is sufficient copper or copper-base alloy present for the composite base to preferably have a coefficient of thermal expansion of at least 9×10−6/° C. A ring frame formed from a nickel/iron-based alloy having a plurality of interconnections extending through sidewalls thereof is bonded to the composite base by a braze with a melting temperature in excess of 700° C. In an alternative embodiment, the composite base brazed to a frame formed from a ceramic having a coefficient of thermal expansion in excess of 8×10−6/° C.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.

Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. The metal foil layer may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent coating a side of the metal foil layer. The enhanced surface is subsequently bonded to a dielectric and the carrier layer then removed.