Abstract: A negatively operating photoresist composition comprising: (a) a polyimide precursor containing repeating structural units of formula (1) ##STR1## the composition comprises in all as many structural units of formula (I), which have residues R.sub.2, that the composition can be developed by means of aqueous-alkaline developers for photoresists, which are free of organic solvents.
Abstract: A photoresist stripping composition containing:(a) 20-70% by weight of an organic polar solvent having a dipole moment of more than 3.5;(b) 70-20% by weight of alkanolamine compounds; and(c) 0.1-10% by weight of 6,6',6"-(1,3,5-triazine-2,4,6-triyltriimino) tris(hexanoic acid).
Type:
Grant
Filed:
January 23, 1996
Date of Patent:
September 9, 1997
Assignee:
Olin Microelectronics Chemicals, Inc.
Inventors:
Kenji Honda, Donald F. Perry, Taishih Maw