Abstract: A dryer for drying a substrate includes: a bath containing a fluid; a chamber; and a delivery system supplying a polar organic compound, such as isopropyl alcohol, and a hydrophobic organic compound, such as hydrofluoroether, to the interface between the substrate and the fluid as the substrate is removed from the fluid of the bath into the chamber. The dryer further includes a chamber environment control system that supplies a gas into the chamber to dry the substrate and controls temperature and humidity in the chamber and a chamber heater attached to the chamber to transfer thermal energy into the chamber. A drying method includes: immersing a substrate into a fluid contained in a bath; removing the substrate from the fluid into a chamber; and supplying isopropyl alcohol and hydrofluoroether to an interface between the substrate and the fluid.

Abstract: A cascaded disk scrubbing system and method are provided. The cascaded disk scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a disk in a vertical orientation through disk preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the disk and to transition the disk in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each disk preparation zone, and the cascaded disk scrubbing system is configured to progress from dirtiest to cleanest as the disk transitions through each disk preparation zone.

Abstract: A dryer for drying a substrate includes: a bath containing a fluid; a chamber; and an isopropyl alcohol delivery system supplying isopropyl alcohol vapor to the interface between the substrate and the fluid when the substrate is removed from the fluid of the bath into the chamber. The isopropyl alcohol vapor is supplied perpendicularly to a vertical axis of the substrate. The dryer further includes a chamber environment control system that supplies a gas into the chamber to dry the substrate and controls temperature and humidity in the chamber and a chamber heater attached to the chamber to transfer thermal energy into the chamber. A drying method includes: immersing a substrate into a fluid contained in a bath; removing the substrate from the fluid into a chamber; and supplying isopropyl alcohol vapor into an interface between the substrate and the fluid perpendicularly to a vertical axis of the substrate.

Abstract: Liquid is removed from wafers for drying a wafer that has been wet in a liquid bath. The wafer and the bath are separated at a controlled rate as the wafer is positioned in a gas-filled volume. The controlled rate is generally not less than the maximum rate at which a meniscus will form between the liquid bath and the surface of the wafer when the liquid bath and the wafer are separated. The gas-filled volume is defined by a hot chamber that continuously transfers thermal energy to the wafer in the gas-filled volume. Hot gas directed into the volume and across the wafer and out of the volume continuously transfers thermal energy to the wafer.

Abstract: A cascaded wafer scrubbing system and method are provided. The cascaded wafer scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a wafer in a vertical orientation through wafer preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the wafer and to transition the wafer in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each wafer preparation zone, and the cascaded wafer scrubbing system is configured to progress from dirtiest to cleanest as the wafer transitions through each wafer preparation zone.

Abstract: Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates . The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath.

Abstract: A substrate polishing system includes two hollow drums and motors for driving the drums in a reciprocating manner. An abrasive tape wound on supply and takeup rollers is introduced, with the supply roller mounted inside one of the drums and the takeup roller mounted inside the other drum. The abrasive tape exits the interior of each drum through a slot in the surface of the drum. Between the drums the abrasive tape passes over a platen having a bearing surface. A substrate is mounted in a carrier and forced against the abrasive tape where it overlies the bearing surface. The drums are rotated reciprocally, thereby causing the abrasive tape to move back and forth over the platen and polishing the substrate. After a substrate has been polished the tape is advanced a selected distance by indexing motors that are connected to the supply and takeup rollers.

Abstract: An apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is orientated vertically between the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.

Abstract: In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

Abstract: In the texturing unit of this invention a data storage disk is gripped between a pair of opposed, counter-rotating cylindrical abrasive mandrels, which are covered with soft, porous pads. The frictional force between the disk and the pads raises the edge of the disk against a pair of driven rollers which impart a rotational motion to the disk. A texture pattern of uniform grooves, having controlled peak heights and valley depths, is formed simultaneously on both sides of the disk. A system for delivering an abrasive slurry to the pads includes a closed loop in which the slurry is recirculated and a dispense section of that loop, from which a blast of pressurized air periodically expels the slurry through applicators and onto the pads. The continuous recirculation of the slurry prevents settling.A unique feature is that the groove length may be controlled by adjusting the ratio between the rotational speeds of the disk and mandrels.

Abstract: In the texturing unit of this invention a data storage disk is gripped between a pair of opposed, counter-rotating cylindrical abrasive mandrels, which are covered with soft, porous pads. The frictional force between the disk and the pads raises the edge of the disk against a pair of driven rollers which impart a rotational motion to the disk. A texture pattern of uniform grooves, having controlled peak heights and valley depths, is formed simultaneously on both sides of the disk. A system for delivering an abrasive slurry to the pads includes a closed loop in which the slurry is recirculated and a dispense section of that loop, from which a blast of pressurized air periodically expels the slurry through applicators and onto the pads. The continuous recirculation of the slurry prevents settling.A unique feature is that the groove length may be controlled by adjusting the ratio between the rotational speeds of the disk and mandrels.