Abstract: A precursor delivery system for an irradiation beam instrument having a vacuum chamber includes an injection tube for injecting gasses into the vacuum chamber of the instrument and a main gas line having an inlet and an outlet. The outlet is connected to the injection tube, and the inlet is connected to a sequential pair of valves connected to a carrier gas source. A crucible for holding precursor material is selectively connected to the main gas line at a location between the pair of valves and the injection tube. The source of carrier gas may be selectively connected to the inlet by sequential operation of the pair of carrier gas valves, so that pulses of carrier gas assist the flow of precursor material to the injection tube. Rapid purging of the system between precursors is enabled by a valve selectively connecting the main line to an envelope in communication with the instrument vacuum. Methods of CVD and etching using the system are also disclosed.

Abstract: Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested.

Abstract: An apparatus for testing flip-chip packages has a programmed computer, a test-engine stage for applying an impact to at least one package under test, and a monitoring stage. The test-engine stage causes an impact on the package on the side opposite its ball-grid array. The test-engine stage has actuators connected to the test-engine stage and the computer, for moving and aligning the test-engine stage. The monitoring stage has a digital camera connected to the computer for transmitting digital images from the ball-grid array side of the package to the computer. A microscope is preferably connected to the digital camera. A sample stage located between the test-engine stage and the monitoring stage holds the package under test. The sample stage has an acoustic transducer capable of being removably connected to the package under test. The acoustic transducer is connected to the computer for transmitting signals from the acoustic transducer to the computer.

Abstract: An apparatus for performing automated in-situ lift-out of a sample from a specimen includes a computer having a memory with computer-readable instructions, a stage for a specimen and a nano-manipulator. The stage and the nano-manipulator are controlled by motion controllers connected to the computer. The nano-manipulator has a probe tip for attachment to samples excised from the specimen. The computer-readable instructions include instructions to cause the stage motion controllers and the nano-manipulator motion controllers, as well as an ion-beam source, to automatically perform in-situ lift-out of a sample from the specimen.

Abstract: A strain detector for in-situ lift-out, comprises a nano-manipulator probe shaft; a strain gauge mounted on the probe shaft; and a first cut-out on the probe shaft. The first cut-out has a rectangular cross-section. There is a second cut-out on the probe shaft; the second cut-out having a semicircular cross-section. The second cut-out is positioned on the shaft opposite from the first cut-out; the first and second cut-out, thus defining a thinned region in the probe. The strain gauge is mounted on the probe shaft at the location of the thinned region. There is detecting circuitry for detecting, amplifying and conditioning the output of the strain gauge; and, wires electrically connecting the strain gauge to the detection circuitry. The wires are preferably located in a trench in the probe shaft. Other embodiments are disclosed having multiple strain gauges and detectors.

Abstract: We disclose a gripper and associated apparatus and methods for delivering nano-manipulator probe tips inside a vacuum chamber. The gripper includes a tube; a compression cylinder inside of and coaxial with the tube; and at least one elastic ring adjacent to the compression cylinder. There is a vacuum seal coaxial with the compression cylinder for receiving and sealing against a probe tip. An actuator is connected to the compression cylinder for compressing the elastic ring and causing it to grip the probe tip. Thus the probe tip can be gripped, transferred to a different location in the vacuum chamber, and released there. Samples attached to the probe tips will be transferred to a TEM sample holder, shown in several embodiments, that includes a bar having opposed ends; an arm attached to each opposed end of the bar; one or more slots for receiving a probe tip; and, each slot having an inner part and an outer part, where the inner part is smaller than the outer part.

Abstract: A method of preparing a sample for examination in a TEM, where the sample is attached to a probe tip point, uses a TEM sample holder form embodied in a TEM sample holder coupon. The probe-tip points and the TEM sample holder coupon are oriented with each other so that the sample is approximately centered in the TEM sample holder form. The probe-tip points are embedded in the TEM sample holder form by means of a press, simultaneously cutting off that portion of every probe-tip point outside the boundary of the TEM sample holder form and cutting the TEM sample holder free from the TEM sample holder coupon. The operation can be formed inside or outside of a focused ion-beam instrument.

Abstract: We disclose an apparatus and method for detecting probe-tip contact with a surface, generally inside a focused ion-beam instrument, where the probe tip is attached to a capsule, and the capsule is movably secured in a probe shaft. There is a fiber-optic cable having a first end and a second end; a beam splitter having first and second output ports; and a light source connected to the beam splitter. The first output port of the beam splitter is connected to the first end of the fiber-optic cable, and the second output port of the beam splitter is connected to a photodiode. The second end of the fiber-optic cable has a mirror for reflecting incident light at approximately a ninety-degree angle to the axis of the optical path in the fiber-optic cable and onto the capsule, so that the intensity of the light reflected back from the capsule through the fiber-optic cable is proportional to the deflection of the capsule as the probe tip makes contact with the surface.

Abstract: A kit for preparing TEM sample holders includes at least one TEM coupon made of a sheet of material and having one or more paths from its edge to a TEM sample holder form embodied in the TEM coupon. There is at least one hole in the coupon defining the outer boundary of the TEM sample holder form. This hole has a mouth that defines a land of material. This land connects the TEM sample holder form to the edge of the sheet. The kit preferably includes at least one probe tip, where the probe tip has a probe-tip point, and finally, a press. The press has inner and outer dies and a former rod opposing the inner and outer dies. A shear punch is situated coaxially with the former rod. Thus, when an actuator drives the shear punch toward the inner and outer dies, the shear punch severs the land and cuts an opening in the TEM sample holder form, and simultaneously the former rod presses the probe tip point or points into the sheet of material.

Abstract: The preferred embodiment further includes a press for cutting a TEM sample holder from a TEM coupon and joining a probe-tip point with an attached sample to the TEM sample holder. The press includes: an outer die; an inner die situated inside the outer die; a former rod opposing the inner and outer dies; and, a shear punch situated coaxially with the former rod. A hold-down spring biases the former rod toward the inner die. A trigger or other mechanism responsive to the contact of the former rod and the inner die, and an actuator responsive to the trigger, drive the shear punch toward the inner and outer dies. This press can be located either inside or outside the vacuum chamber of the FIB or other analytical instrument.

Abstract: A TEM sample holder is formed by cutting the TEM sample holder form from a coupon in a press. The cutting at the same time joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM. The cutting process also creates a gap in the sample holder to allow for FIB milling of the specimen.

Abstract: A coupon for preparing a TEM sample holder comprises a sheet of material that includes a TEM sample holder form. There is at least one section of the sheet connecting the TEM sample holder form to other portions of the sheet. A TEM sample holder is formed by cutting the TEM sample holder form from the coupon in a press. The cutting joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM.

Abstract: We disclose a method for analyzing the composition of a microscopic particle resting on a first sample surface. The method comprises positioning a micro-manipulator probe near the particle; attaching the particle to the probe; moving the probe and the attached particle away from the first sample surface; positioning the particle on a second sample surface; and, analyzing the composition of the particle on the second sample surface by energy-dispersive X-ray analysis or detection of Auger electrons. The second surface has a reduced or non-interfering background signal during analysis relative to the background signal of the first surface. We also disclose methods for adjusting the electrostatic forces and DC potentials between the probe, the particle, and the sample surfaces to effect removal of the particle, and its transfer and relocation to the second sample surface.

Abstract: A sample (180) is separated from an integrated circuit chip or a semiconductor wafer (100) for examination so that the resulting sample (180) can be moved to a location for examination by TEM, SEM or other means. A sample (180) portion of the chip or wafer (100) containing an area of interest is separated with a two cuts (140, 160) at two different angles (130, 170) by a focused ion-beam (120). Only after the sample (180) is separated is it fixed to a micromanipulator probe (190). The sample (180) is then moved by the probe (190) to the location for examination.

Abstract: When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam. Prior to separation, the sample is fixed to a micromanipulator probe. The sample is moved by the probe to the location for examination and fixed there. The probe is then detached from the sample by the focused ion-beam.