Patents Assigned to Omron Corp.
  • Patent number: 10182099
    Abstract: Methods, systems and an apparatus for a web-based interface to an embedded web server that facilitates accessing and presenting complex data on any web-enabled device using standard data communication protocols without disrupting the operation of the data acquisition device in which the web server is embedded.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: January 15, 2019
    Assignee: Omron Corp.
    Inventors: Joseph J. Dziezanowski, Erik S. Lewerenz, Darren Prevost, Matthew Van Bogart
  • Patent number: 6782986
    Abstract: The bill counter has thickness detection units 31, 32, and 33 for detecting the thickness of a bill passing through a transport passage. The thickness detection units 31, 32, and 33 are separately placed on the transport passage. Waveform outputs from the thickness detection units 31, 32, and 33, provided by detecting the thicknesses of predetermined parts of bill passing through the transport passage are compared with waveform data previously stored in a storage unit and the number of bills passing through the transport passage is determined.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: August 31, 2004
    Assignee: Omron Corp.
    Inventors: Kinya Toda, Masaki Yamada, Toshiya Hamasaki, Toru Fujii
  • Patent number: 6557943
    Abstract: A cable guide is provided for a movable body such as a chair having legs with casters. The cable guide guides a cable attached to the movable member away from the casters during movement of the movable member and/or horizontal rotation of a portion of the movable member.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: May 6, 2003
    Assignee: Omron Corp.
    Inventor: Masahiro Ando
  • Patent number: 5084893
    Abstract: In a ridge waveguide-type semiconductor light-emitting device, a buried layer is composed of a high-resistance semiconductor material (e.g., amorphous silicon), thereby improving the heat-dissipating characteristic and prolonging lifetime. The buried layer is made higher than the top surface of the ridge, the top surface of the ridge is situated in the resulting recess, and an electrode is formed from the top surface of the ridge to the top surface of the surrounding buried layer to cover the entirety of these surfaces. Making the buried layer higher than the top of the ridge prevents an electrical short circuit for being caused by an electrically conductive bonding agent used in junction-down mounting.
    Type: Grant
    Filed: June 18, 1990
    Date of Patent: January 28, 1992
    Assignee: Omron Corp.
    Inventors: Hiroshi Sekii, Koichi Imanaka