Abstract: A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover and an abutting member disposed between the cover and the electrically connecting units. The cover is disposed on the circuit board to jointly define an accommodating space that accommodates the abutting member and the electrically connecting units. The cover can be connected to an air suction apparatus for expelling air in the accommodating space. When the air suction apparatus performs a suction operation to expel the air in the accommodating space, the abutting member is abutted against the electrically connecting units and the chips so as to connect each of the electrically connecting units and the corresponding chip.

Abstract: A chip testing system includes a central control device, a chip mounting apparatus, a plurality of environment control apparatus, a classification apparatus, and a transferring apparatus. The central control device is configured to control the chip mounting apparatus to dispose a plurality of chips onto a chip testing device. Each of the environment control apparatus includes a plurality of accommodating chambers that are independent from each other. Each of the accommodating chambers is provided with a temperature adjusting device. The central control device is configured to control the transferring apparatus to place the chip testing device into one of the accommodating chambers. When the chip testing device carrying the chips is arranged in the corresponding accommodating chamber, the central control device is configured to control an operation of the corresponding temperature adjusting device, so that the chips are in an environment of a predetermined temperature.

Abstract: A chip testing circuit and a testing method thereof are provided. The chip testing circuit includes a parameter measurement circuit, a plurality of power supply circuits, a plurality of switch circuits, and a control circuit. The plurality of power supply circuits respectively provide power supply to a plurality of chips carried by a plurality of sockets. Each switch circuit is electrically connected between one socket and one power supply circuit. The control circuit is connected in parallel to a plurality of signal pins of the plurality of chips carried by the plurality of sockets, so that when the control circuit outputs test data, all the chips can simultaneously receive the test data. When executing a parametric test mode, the control circuit controls one of the switch circuits to be turned on and controls the parameter measurement circuit to perform an electrical performance test on the chips.

Abstract: A system-level testing apparatus and a system-level testing system are provided. The system-level testing apparatus includes an apparatus body, a chip carrying device, and a control device. A holding structure in the apparatus body is configured to hold a system circuit board. The chip carrying device includes a carrying circuit board, and a plurality of electrical connection sockets and a plurality of connection structures are disposed on the carrying circuit board. The electrical connection structures are electrically connected to the connection structures. When the electrical connection sockets carry a plurality of chips under test, the carrying circuit board is disposed on the system circuit board, and the connection structures are connected to a plurality of system connection structures of the system circuit board, the control device can transmit a test signal to perform a system-level test operation to the system circuit board and the chips under test.

Abstract: A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

Abstract: An environment control apparatus includes an apparatus body, a processing device, a plurality of heating devices, and a plurality of cooling devices. The apparatus body includes a plurality of accommodating chambers each having one of the heating devices or one of the cooling devices. Each of the heating devices has a high temperature contacting structure, and each of the cooling devices has a low temperature contacting structure. When a chip testing device carrying chips is arranged in one of the accommodating chambers, the chip testing device is supplied with electricity, and the heating device or the cooling device of the one of the accommodating chambers is in operation, the chip testing device is configured to test the chips disposed thereon.

Abstract: A chip testing device for being transferred among a plurality of working stations includes a circuit board, a control set, and a plurality of connection terminals. The circuit board is provided with a plurality of electrical connection sockets disposed thereon each for carrying a chip. The control set includes a plurality of testing modules disposed on the circuit board. The connection terminals are disposed on the circuit board. When the connection terminals are connected to an external power supply device, the testing modules are connected to the electrical connection sockets, and each of the testing modules is able to test the chip on the electrical connection socket connected thereto.

Abstract: An environment control device and a chip testing system are provided. An apparatus body of the environment control device includes a plurality of accommodating chambers. Each of the accommodating chambers has a temperature adjusting device disposed therein. Each of the accommodating adjusting devices includes a temperature adjuster, a contacting structure, a frame body, and an elastic annular enclosed member. When a chip testing device carrying a plurality of chips is disposed in one of the accommodating chambers, and the contacting structure contacts one side of the chips, the elastic annular enclosed member is abutted against the chip testing device, and the chip testing device and the contacting structure jointly define an enclosed space. The temperature adjuster can correspondingly adjust the temperature of the contacting structure so that the chip testing device can perform a predetermined testing process on the chips in a predetermined temperature environment.

Abstract: A testing apparatus includes a pressing device and a chip carrying device. The chip carrying device includes a circuit board and a plurality of electrically connecting units. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure, a supporting structure, an elastic assembly sandwiched between the lift structure and the supporting structure, and a plurality of probe assemblies, the latter four of which are arranged in the accommodating slot. The lift structure has a chip receiving slot for receiving a chip. When the chip receiving slot receives the chip and the lift structure is not pressed, the probe assemblies are not connected to the chip. When the chip receiving slot receives the chip and the lift structure is pressed by the pressing device to move toward the accommodating slot, the probe assemblies are connected to the chip.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.

Abstract: An environment control apparatus includes an apparatus body, a processing device, and a plurality of temperature adjusting devices. The apparatus body includes a plurality of accommodating chambers each having one of the temperature adjusting devices. Each of the temperature adjusting devices has a heater and a cooler. When a chip testing device carrying a plurality of chips is arranged in one of the accommodating chambers, the chip testing device is supplied with electricity, and the heater and the cooler of the corresponding temperature adjusting device are controlled to operate, the chip testing device performs a testing process on the chips disposed thereon.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover, an abutting member, and an airtight member. The cover is disposed on the circuit board to jointly define an accommodating space accommodating the abutting member and the electrically connecting units. The airtight member is arranged between the cover and the circuit board to seal the accommodating space. The cover has at least one exhaust hole. When an air suction apparatus exhausts air in the accommodating space through the at least one exhaust hole, the cover is abutted against the airtight member, and the abutting member is abutted against the chips to connect each of the electrically connecting units and the corresponding chip.