Abstract: An antenna structure at least includes a chip antenna. The chip antenna includes: a carrier, a first radiating unit, a second radiating unit, and an electric conductor. The first radiating unit is repeatedly designed with two or more periodic pattern layers to increase the bandwidth of the chip antenna and reduce the frequency point of the chip antenna, thereby improving the performance of the antenna. The first radiating unit is arranged on a top surface of the carrier to control the high-frequency band impedance, resonant frequency, and radiation effect, and use two or more periodic pattern layers to generate the frequency multiplication of the low-frequency band and control the frequency offset of the high-frequency band. The second radiating unit on a bottom surface controls the low-frequency band to achieve the predetermined target impedance, resonant frequency, bandwidth, and radiation effect. The size of the antenna is effectively reduced.

Abstract: An antenna structure is electrically fixed and connected to a main board of an electronic apparatus and includes a circuit board, a high-frequency radiation layer, and a low-frequency radiation layer. The circuit board is a square body with a front surface, a back surface, a top surface, a bottom surface, and two side surfaces. The high-frequency radiation layer is arranged on the front surface of the circuit board and includes a high-frequency coupling edge thereon. The low-frequency radiation layer is arranged on the back surface of the circuit board and includes a low-frequency coupling edge thereon. Moreover, the high-frequency radiation layer and the low-frequency radiation layer fail to overlap with each other. The high-frequency coupling edge and the low-frequency coupling edge couple together to generate a bandwidth of a transmitting-and-receiving frequency of the antenna structure.

Abstract: A structure includes an antenna structure and a mainboard. The antenna structure includes a circuit board, an electrode layer, and at least one half-hole electrode layer. The electrode layer and the half-hole electrode layer are arranged on the circuit board. A first solder pad and a second solder pad are arranged on the mainboard. A first electrode layer and a second electrode layer of the electrode layer, and the half-hole electrode layer arranged on the circuit board are electrically fixedly connected to the first solder pad and the second solder pad. When the antenna structure is soldered onto the mainboard, the soldering stability and solidity for the antenna structure is increased to prevent the antenna structure from shifting during production using surface mount technology. The solder pads are added to grasp the body of the antenna structure, thereby improving the problem of detaching when dropped.

Abstract: An antenna structure at least includes a chip antenna. The chip antenna includes: a carrier, a first radiating unit, a second radiating unit, and an electric conductor. The first radiating unit is repeatedly designed with two or more periodic pattern layers to increase the bandwidth of the chip antenna and reduce the frequency point of the chip antenna, thereby improving the performance of the antenna. The first radiating unit is arranged on a top surface of the carrier to control the high-frequency band impedance, resonant frequency, and radiation effect, and use two or more periodic pattern layers to generate the frequency multiplication of the low-frequency band and control the frequency offset of the high-frequency band. The second radiating unit on a bottom surface controls the low-frequency band to achieve the predetermined target impedance, resonant frequency, bandwidth, and radiation effect. The size of the antenna is effectively reduced.

Abstract: A vertical antenna structure is electrically fixed and connected to a main board of an electronic apparatus. The vertical antenna structure includes a circuit board, an electrode layer, and a semi-hole electrode layer. The circuit board is a square body with a front surface, a back surface, a top surface, a bottom surface and two side surfaces. The electrode layer is arranged on the front surface and the back surface of the circuit board. The semi-hole electrode layer is arranged on the bottom surface of the circuit board. The semi-hole electrode layer is electrically fixed and connected to the electrode layer. Moreover, the electrode layer and the semi-hole electrode layer are electrically fixed and connected to the main board.

Abstract: A downlight apparatus includes a driver, a light source, a light holder, a first switch and a second switch. The driver has a power converter and a controller. The light holder is used for fixing the light source. The holder bottom of the light holder defines a light opening. The light source emits a light from the light opening. The light holder is placed in an installation cavity. The rim structure is connected to the holder bottom. The rim structure has a rim edge concealing the installation cavity. The first switch is provided for users to operate to adjust a setting. The second switch is provided for users to operate to adjust the setting. The first switch is concealed in the installation cavity. The second switch is placed on the rim edge exposed outside the installation cavity. The first switch and the second switch are coupled to the controller.

Abstract: An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.