Abstract: Dry adhesive microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.
Type:
Grant
Filed:
November 7, 2022
Date of Patent:
October 15, 2024
Assignee:
OnRobot A/S
Inventors:
Mohammad Dadkhah Tehrani, Nicholas Wettels
Abstract: A connector (70) for mechanically connecting a device (2) to a robot (20), wherein the connector (70) comprises a first portion (74) configured to be attached to the robot (20) and a second portion (76) configured to be attached to a device (2) configured to be connected to the robot (20). The first portion (74) and the second portion (76) are detachably attached to each other by a first connection portion (1) constituting a rotational system comprising a pivot (116) about which the first portion (74) can rotate with respect to the second portion (76) and a second connection portion (1?) constituting a mechanical locking structure that prevents the first portion (74) and the second portion (76) from being detached from each other.
Type:
Grant
Filed:
June 15, 2020
Date of Patent:
February 21, 2023
Assignee:
ONROBOT A/S
Inventors:
Lasse Kieffer, Peter Nadolny Madsen, Henrik Tillitz Hansen
Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.
Type:
Grant
Filed:
March 30, 2020
Date of Patent:
December 27, 2022
Assignee:
OnRobot A/S
Inventors:
Mohammad Dadkhah Tehrani, Nicholas Wettels
Abstract: A gripping device (2) configured to be detachably attached to a robot (20). The gripping device (2) comprises one or more extremities (10, 10?) provided with one or more suction members (12, 12?) connected to a vacuum source (18). At least two of the extremities (10, 10?) are rotatably arranged with respect to each other.
Type:
Grant
Filed:
June 13, 2020
Date of Patent:
June 21, 2022
Assignee:
ONROBOT A/S
Inventors:
Lasse Kieffer, Peter Nadolny Madsen, Henrik Tillitz Hansen
Abstract: Provided are systems, devices, and methods for sensing location and forces. A robotic effector comprising a skin and a core can have a plurality of electrodes integrated in the skin and/or core. Upon interaction with a target object, the robotic effector may determine a total force and/or a location of the force by the target object on the robotic effector. Sensitivity and dynamic range of the robotic effector may improve by changing various configurations.
Type:
Grant
Filed:
December 2, 2019
Date of Patent:
November 2, 2021
Assignee:
ONROBOT A/S
Inventors:
Nicholas Wettels, Keoni Dade, Menuka Gamage