Abstract: Heat transfer apparatus comprising, in combination inner and outer bodies defining a space therebetween which extends at least part way about an axis, at least one of the bodies being heat conductive, a heat conductive woven mesh extending in the space at least part way about the axis, and in heat transfer relation with at least one of the bodies, fluid in the space in heat transfer contact with the mesh, and solar cells carried by the outer body.

Abstract: Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination, structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with said element, a rotatably tightenable connection between said package and said hollow body, and acting to block leakage of cooling fluid from said cavity.

Abstract: Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.

Abstract: A cooling device for cooling an electronic component. The device has an enclosure adapted to contain a liquid coolant. The enclosure has an internal channel system comprising a cavity adjacent the electronic component, a first group of arborizing channels adapted to carry the liquid coolant away from the cavity, a second group of arborizing channels adapted to carry the liquid coolant to the cavity, and a plenum fluidically connecting the first and seconds groups of arborizing channels. Each group of arborizing channels has a parent branch and multiple successive sets of daughter branches with successively smaller cross-sectional areas, wherein the sum of the cross-sectional areas of the daughter branches of any set is approximately the same as that of its parent branch. Distal sets of the daughter branches are most distant from the cavity, fluidically connected to the plenum, and have the smallest cross-sectional areas of the daughter branches.

Abstract: Circuit board assemblies and methods that employ integrated heatspreaders to cool the assemblies and serve as electrical ground planes for the assemblies. Such a circuit board assembly includes a substrate having at least one circuit device on at least a first surface thereof and an electrical ground plane. The circuit device has a first set of solder connections electrically connected to the electrical ground plane and a second set of solder connections electrically connected to power and signal traces on the first surface of the substrate. The assembly further includes a heatspreader embedded in the substrate and defining an electrical element of the electrical ground plane as a result of being electrically connected to the first set of solder connections. The heatspreader is configured as a plate-mesh-plate laminate that defines a cavity containing a fluid for transferring heat from the circuit device.

Abstract: A cooling system and method for cooling electronic components, including IC dies. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates, with the strands bonded to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and flows through interstices defined by and between the strands of the mesh.

Abstract: A collapsible support stand includes a base upon which a weight may be placed for stability. A foundation plate is rotatably attached to the base and is coupled to a telescoping column. The telescoping column includes multiple tubes nestable within one another. The stand also includes a leveling system having multiple knobs that, when rotated, may adjust the angle of the post relative to the foundation plate and base.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: An illuminated sign includes a plurality of sections. Each section includes a mesh of conductors having illuminating pixels located at conductor intersections. The mesh is surrounded by a frame connected to the frame of another section. Once frame sections of the display are unfolded, the display can be supported by a structure attached to a car or other vehicle. A support structure for an illuminated display includes a base which is placed on the ground and over which the tire of a vehicle (e.g., a police car) is parked. A column extends from the base, and a display can be attached to the top of that extending column.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A lighted display panel includes a plurality of illumination layers, with each layer having leading and trailing edges. Each of the layers has a cross section in which the leading and trailing edges are angled toward an upper or lower face of the layer. In some cases, the leading and trailing edges are offset from one another. In other cases, the illumination layer has a wing shape. Lighting elements (e.g., LEDs) are located in the leading edges of the illumination layers. The illumination layers define vents through which air may flow, but which obstruct the passage of light.

Abstract: An illuminated sign includes a plurality of sections. Each section includes a mesh of conductors having illuminating pixels located at conductor intersections. The mesh is surrounded by a frame connected to the frame of another section. Once frame sections of the display are unfolded, the display can be supported by a structure attached to a car or other vehicle. A support structure for an illuminated display includes a base which is placed on the ground and over which the tire of a vehicle (e.g., a police car) is parked. A column extends from the base, and a display can be attached to the top of that extending column. The support structure can take the form of a collapsible stand having a trunk which is pivotally attached to a base and which contains a telescoping section.