Abstract: A drip chemical delivery system used in semiconductor substrate cleaning processes. A drip chemical delivery system which uses small openings in a pipe (holes) and a low air pressure to saturate the brushes in a double sided brush system. This drip delivery system reduces the volumes of chemical solutions used in a scrubbing process and helps to maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a double sided scrubber.
Abstract: A drip chemical delivery system used in semiconductor substrate cleaning processes. A drip chemical delivery system which uses small openings in a pipe (holes) and a low air pressure to saturate the brushes in a double sided brush system. This drip delivery system reduces the volumes of chemical solutions used in a scrubbing process and helps to maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a double sided scrubber.
Abstract: A process for brush cleaning used in semiconductor wafer scrubbing systems. A process for brush cleaning that eliminates and/or reduces the load-up of brushes with contaminants. This brush cleaning process changes the pH level of a brush to repel contaminants that are on the brush. This process extends the useful life of the brush without significantly decreasing the throughput of the scrubbing system.