Patents Assigned to OPL Limited
  • Structure and method for providing a lead frame with enhanced solder wetting leads
    Patent number: 5444293
    Abstract: A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 percent.
    Type: Grant
    Filed: September 22, 1993
    Date of Patent: August 22, 1995
    Assignee: OPL Limited
    Inventor: Tung L. Li