Abstract: A low thermal impedance optoelectronic device includes an optical cavity adjacent a low thermal impedance DBR that provides improved heat dissipation and temperature performance. The thermal impedance of the DBR may be reduced by increasing the relative or absolute thickness of a layer of high thermal conductivity material relative to a layer of low thermal conductivity material for at least a portion of the mirror periods. The thermal impedance may also be reduced by increasing the distance between phonon scattering surfaces by increasing the thickness of the high thermal conductivity layer, the low thermal conductivity layer or both.

Abstract: A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.

Abstract: A method and apparatus for determining substrate temperature and the mirror center of a film structure formed on the substrate utilizes a transmission intensity spectrum of light to determine mirror center and a normalized transmission intensity spectrum of light to determine substrate temperature. White light is transmitted through the substrate and the film structure during the film structure formation process. Also during the film formation process, a reflected light intensity spectrum is obtained using the same or another light source, for light reflected by the film structure. Substrate temperature and mirror center may be determined during formation of the film structure and, based on the measured temperature and mirror center, the mirror center may be adjusted by changing film formation conditions during the film formation process to vary the thickness of the films being formed.

Abstract: An optical subassembly (OSA) includes a ferrule, an optical fiber, a ceramic substrate, and a seal coupled to the ceramic substrate. A weld sleeve is used to fixably couple the ferrule to the seal ring, for which the weld sleeve may be laser welded to the ferrule and/or the seal ring. The OSA may be a transmitter OSA or a receiver OSA, and may be hermetically sealed.

Abstract: A pluggable optical transceiver having a slidable actuator assembly for quickly and easily removing the transceiver from a receptacle cage assembly is provided. The actuator assembly includes an actuator collar and slide member that can slide in a forward and rearward direction. As force is exerted on the actuator collar, the actuator and slide member slide rearwardly causing the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: A pluggable optical transceiver having a pivotable actuator assembly for quickly and easily removing the transceiver from a receptacle cage is provided. The actuator assembly includes a pivotable lever arm and a slide member that can slide in a forward and rearward direction. Force is first applied to the actuator lever so that it pivots and rotates to a different position. Then, as force is applied to the pivoted actuator lever, the slide member slides rearwardly causing the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: A pluggable optical transceiver having a having a slidable actuator assembly for quickly and easily removing the transceiver from a receptacle cage assembly is provided. The actuator assembly includes a curved actuator handle and slide member that can slide in a forward and rearward direction. As force is exerted on slide member, the actuator and slide member slide rearwardly causing the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: A pluggable optical transceiver having a pivotable actuator assembly for quickly and easily removing the transceiver from a receptacle cage assembly is provided. The actuator assembly includes a slide member, actuator means, and spring means. The rotation of the actuator causes the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: An optical subassembly configured to passively align an optical fiber with an optical device. The optical subassembly including a submount having a guide hole with a first tapered portion for guiding an optical fiber into a second portion of substantially constant cross section, wherein the second portion aligns the optical fiber with the optical device.

Abstract: A vertical cavity laser includes an optical cavity adjacent to a first mirror, the optical cavity having a semiconductor portion and a dielectric spacer layer. A dielectric DBR is deposited adjacent to the dielectric spacer layer. The interface between the semiconductor portion of the optical cavity and the dielectric spacer layer is advantageously located at or near a null in the optical standing wave intensity pattern of the vertical cavity laser to reduce the losses or scattering associated with that interface.

Abstract: A plastic encapsulated VCSEL and power monitoring system wherein the VCSEL and photodetector are encapsulated in an optoelectronic plastic molding material. A tilted window, with a partially reflective coating on one side, is attached to the top of the plastic molding material using an epoxy with a refractive index that substantially matches the molding material. The plastic encapsulated VCSEL and photodetector may be manufactured at low cost using standard molding techniques. The high optical quality of the tilted window and partially reflective coating provide an excellent surface to reflect a portion of the optical beam back to the photodetector. Also, the tilted window substantially reduces inconsistent power monitoring due to beam divergence and walk-off.

Abstract: A conductive plastic optical-electronic interface incorporates a rigid double-sided printed circuit board (PCB) for small compact size design with surface mount technology in a small sixteen pin dual-in-line housing with a protruding receptacle for a ferrule at the end of a fiber-optic cable. The conductive plastic housing is injection molded in three parts using a mixture of conductive fibers and plastic chosen for RFI/EMI shielding. The PCB slides into slots in a frame for the housing for mechanical rigidity and a base and lid seal the PCB in the housing. A rubber cup may be placed over the receptacle to seal against environmental conditions while soldering and cleaning the dual-in-line sixteen pin package to a system printed circuit board. The design is suitable for all the bit rates using single or multimode fiber and applicable to all wavelengths.