Abstract: The invention is directed to a bonding pad metallization for stress sensitive semiconductor devices such as semiconductor lasers or the like. An attendant advantage is a diffusion barrier layer which inhibits the migration of conventional bonding materials such as indium solder.
Abstract: A high speed photodetector, for use with semi-conductor lasers or the like, is configured to receive light signals upon a beveled detector facet, directing the incident light through a semiconductor window layer to the detector's junction region.
Abstract: A transient suppression circuit is provided for starting up or turning off a light emitting diode, such as a diode laser. The circuit minimizes the possibility of turn-on or turn-off transients or overshoot, employing a time delayed voltage. A diode circuit is used which generates an output voltage equal to the higher of two voltages at its two inputs, one input being the time delayed voltage and the second being derived from photodetector which detects electromagnetic radiation emitted by the light emitting diode. The circuit also utilizes a three terminal voltage regulator which maintains a constant voltage between its sense terminal (output from the diode circuit) and its output terminal.
Abstract: A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining a coaxial geometry, useful in optical and thermal control. Techniques for bonding devices into the package are easily automated using conventional bonding and assembly equipment. The package permits use of the device in a variety of orientations.
Type:
Grant
Filed:
May 5, 1980
Date of Patent:
September 7, 1982
Assignee:
Optical Information Systems, Inc.
Inventors:
Peter S. Zory, Frederick W. Scholl, Harry F. Lockwood
Abstract: A digital modulator provides high speed modulation of a semiconductor diode laser or light emitting diode. The circuit is compatible with standard TTL and ECL integrated logic circuits and operates with a positive ground for convenient heat sinking.