Abstract: A thin film interconnect module utilizes a plurality of electroplated conductors disposed in one or more signal layers and surrounded by a dielectric having substantially the same thickness as the conductors to form a substantially planar layer. A metal/dielectric film is employed electrically to interconnect with various ones of the conductors during the electroplating process. After electroplating, selected ones of the electrical interconnections are broken by heating or irradiating selected ones of the interconnections. A dielectric-like film composed of microscopic non-contacting metal islands is used to link conductors that may subsequently need to be electrically connected, the electrical connection being achieved by melting the islands to form a continuous metal film. Interconnections between different planar layers may be achieved by the use of plated through holes. The process permits high density, high aspect ratio conductors to be fabricated on a multi-layer interconnect module.

Abstract: An optical recording media having a thermally insulating film to minimize heat loss wherein the thickness of the film is not critical for recording. The thermally insulating film is disposed between a metal coated substrate and a dielectric-like film to form the optical recording media. When a spot on the dielectric-like film is exposed to a focused laser the coloration thereof changes to store multiple bits of information at a single spot.

Abstract: An optical recording media formed of a composite film the coloration of which changes when exposed to a focused laser to store multiple bits of information at a single spot. The media is formed by depositing a metal film on a substrate; oxidizing a layer of the metal film to form an amorphous film; and depositing a dielectric-like film on the amorphous film.

Abstract: A method and apparatus for making electrical connections between conductors on a substrate utilizes a dielectric-like metal film deposited on the substrate interconnecting the conductors to be connected. The dielectric-like film is deposited in the form of microscopic islands or columns that are spaced by microscopic distances, thus making the film non-conductive when deposited. When an electrical connection is desired, the dielectric-like film is melted by localized heating, for example, by a focused laser, thereby melting the individual metal islands and permitting them to flow together to make the film conductive.

Abstract: A method and apparatus for selectively disconnecting two electrical conductors either on the surface or below the surface of a semiconductor chip or a thin film interconnection module connecting several semiconductor chips utilizes a thin metal film such as a silver film that is deposited over the ends of two conductors that it may become necessary to disconnect in the future. An insulating layer, such as a silver halide film, having the capability of absorbing the silver film under irradiation or upon heating is deposited over the silver film. Before irradiation or heating, the silver film provides a low resistance electrical connection between the two conductors. When it is desired to disconnect the two conductors, the insulating layer is irradiated by a focused source such as a laser, thus causing the insulating layer to absorb the metal film, thereby breaking the electrical connection between the conductors.