Abstract: A patterned specimen inspection system achieves the inherent advantages of the die to statistical image (DSI) inspection mode for repetitive and random patterns and simultaneously achieves the inspection speed of the optical pattern filtering (OPF) mode. A preferred embodiment entails producing a patterned specimen wafer image with coherent optical spatial frequency filtering, as in the OPF mode, and carrying out defect detection by pixel comparison, as in the DSI mode. For repetitive and random pattern areas, implementation of the invention increases the inspection speed of the DSI mode to approach that of the OPF mode because image spatial filtering enables the use of a large sized unit pixel. For the repetitive pattern, the ability to use a large unit pixel size results from the complete removal of light energy from the repetitive patterns in the image.

Abstract: An inspection system (2) employs a beam of monochromatic light (12) that travels through a Fourier transform lens (16) before striking a specimen wafer (4) at an angle (.THETA.) with respect to the normal (26) of the specimen wafer (4) to produce diffracted light (28b ) and 28c) that has a broad spatial frequency spectrum which can be selectively filtered to produce a dark field image pattern of the various sized defects in an inspection area (22) of the wafer. The nearly collimated beam of monochromatic light strikes the wafer at an angle (.THETA.) with respect to the normal of the wafer of between zero degrees and a predetermined maximum angle. For the inspection system disclosed, the predetermined maximum angle is the angle formed when the beam of monochromatic light is as far away from the optic axis as possible yet still within the numerical aperture of the Fourier transform lens (16). Moreover, if a specific range of defect sizes is anticipated, the system can be optimized by setting the angle (.THETA.

Abstract: An apparatus having a set of apertures of selected diameters, each aperture being positioned in a multiaperture assembly that can be moved to bring selectively each of these apertures into a path of a beam. This enables control of the diameter of an aperture in a beam and also enables accurate positioning of that aperture so that it is centered on the beam where it is moved to a position of alignment with the beam.