Abstract: Bistable latching actuator for use in optical fiber switching applications having a generally planar mechanism with an arm that carries a mirror for movement in a direction perpendicular to the plane of the mechanism, and a bistable mechanical latch for retaining the mirror in stable positions on opposite sides of the plane without contacting the arm. Movement between the two stable positions is initiated and damped with an electrostatic comb drive.

Abstract: A tunable filter with a flattopped passband is provided for use as a micromachined optical filter with input and output optical fibers which provides a wavelength tunability with several discrete wavelengths and a flattopped passband. The standard Fabry-Perot resonator is modified by incorporating multilayer dielectrics to form a pair of interference filters, one of which is vibrated to provide for tunability and provision of several resonant wavelengths. The layers can either be deposited on an existing dielectric slab of a Fabry-Perot device or included on the ends of the input and output optical fibers which are then incorporated into the Fabry-Perot device.

Abstract: Optical fibers are aligned in a jig of parallel apertured plates in which the fibers are inserted and positioned by the use of V-shaped or positioning ribbon actuators. The actuators are thermally actuated by a closed loop feedback system to center each individual fiber and its light output on an equivalent juxtaposed photodetector array. When the fiber is centered by this feedback technique it is permanently fixed in that position by potting, for example. The feedback control constitutes either a totally electrical system utilizing a processing unit or can be partially manually controlled by a human operator operating a joystick and viewing a meter or similar device which indicates an approach to a maximum output from a photodetector.

Abstract: A latching mechanism for a MEMS actuator as, for example, a mirror in an N×N fiber optic switch, maintains a thermally actuated mirror in its actuated position even in the event of a power interruption by a pair of clamps, which clamp against an actuator arm. Such actuator arm is thermally actuated by a bent beam type of thermal actuator. To provide for effective fabrication using the MEMS technique (microelectromechanical system), on for example, a silicon substrate where the entire moveable structure is a suspended mechanism, the clamps are fabricated in a normally closed position. In this position they typically interfere with the line of motion of an enlarged portion of an actuator arm being directly in the line of motion or with a post and slot technique.

Abstract: A micro electromechanical switch for detecting acceleration or deceleration includes a rectangular planar mass of, for example, etched silicon suspended on a pair of beams from an anchor located in the same silicon base. Motion in a plane of movement caused by acceleration or deceleration is detected by a pair of photodiodes and a light emitting diode located on opposite sides of the planar mass or shutter so that when the shutter moves the interruption of the light is sensed and thus acceleration or deceleration is indicated.

Abstract: A latching mechanism for a MEMS actuator as, for example, a mirror in an N×N fiber optic switch, maintains a thermally actuated mirror in its actuated position even in the event of a power interruption by a pair of clamps, which clamp against an actuator arm. Such actuator arm is thermally actuated by a bent beam type of thermal actuator. To provide for effective fabrication using the MEMS technique (microelectromechanical system), on for example, a silicon substrate where the entire moveable structure is a suspended mechanism, the clamps are fabricated in a normally closed position. In this position they typically interfere with the line of motion of an enlarged portion of an actuator arm being directly in the line of motion or with a post and slot technique.

Abstract: A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.