Abstract: The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead (103a, 103b) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield (103c, 103d, 104, 104a, 104b, 104f) that electrically shields the at least one signal lead (103a, 103b) from the at least one auxiliary lead. The shield (103c, 103d, 104, 104a, 104b, 104f) has such dimensions (d1, d2) and is positioned at such distance (d3, d4, d12) from the at least one signal lead (103a, 103b) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e.

Abstract: The present invention provides a method and apparatus for hot-pluggable electronic component connection. In one embodiment of the present invention, ground and power line couplings with a system are formed by moving the component in one direction while signal line couplings with the system are formed by moving the component in another direction. In one embodiment, a guide rail system causes a hot-pluggable component to move in a direction which couples, first, the ground line and, then, the power lines to the system. After the ground and power lines are connected, the guide rail system causes the component to move in another direction which couples the signal lines to the system. In another embodiment, a latching mechanism holds the component in place once the signal lines are coupled to the system. In this embodiment, an ejection system releases the latching mechanism and allows removal of the component.