Abstract: A method of testing a tester, comprising testing electronic units using a plurality of sites in order to obtain first bin assignment, instructing the tester to perform a tester quality test if conditions CiQA,1 and CiQA,2 are met, the tester quality test comprising performing a second plurality of tests on an electronic unit using a first site, thereby obtaining second bin assignment for the electronic unit, the second bin assignment being representative of passing or failing of the electronic unit of the second plurality of tests with respect to at least one second test criteria, wherein CiQA,1 is met if passing first bin assignment has been obtained for said electronic unit connected to the tester using the first site, and wherein CiQA,2 is met if data representative of passing first bin assignment obtained for electronic units which have been tested on the first site, meets a quality criteria.

Abstract: Systems and methods for sorting an electronic device undergoing a final test operation in accordance with a test program, into one of a plurality of bins. In one embodiment, an evaluator defines the binning of the electronic device while the device is still socketed, and the defined binning may or may not concur with the binning assigned by the test program.

Abstract: Systems and methods for deciding whether or not to indicate misalignment. In some examples, an analysis of parametric data relating to tests sensitive to misalignment is performed in order to determine which data is incongruous and to identify corresponding probes or socket contacts as suspected misaligned. In some examples, additionally or alternatively, a spatial analysis quantifies the placement of a set of identified suspected misaligned probes, which were identified from pass/fail test data and/or parametric test data, with respect to a contiguous or non-contiguous area on one or more wafers.

Abstract: Methods, systems, computer-program products and program-storage devices for determining whether or not to perform an action based at least partly on an estimated maximum test-range. One method comprises: attaining results generated from a parametric test on semiconductor devices included in a control set; selecting from the semiconductor devices at least one extreme subset including at least one of a high-scoring subset and a low-scoring subset; plotting at least results of the at least one extreme subset; fitting a plurality of curves to a plurality of subsets of the results; extending the curves to the zero-probability axis for the low-scoring subset or the one-probability axis for the high-scoring subset to define a corresponding plurality of intersection points; defining an estimated maximum test range based on at least one of the intersection points; and determining whether or not to perform an action based at least partly on the estimated maximum test range.