Patents Assigned to Option It, Inc.
  • Patent number: 6789294
    Abstract: The self-fastening handle assembly includes a carrier panel with an aperture. A base member has a central bore and a bottom surface. Fingers, which extend from the bottom surface of the base member, are in a first arrangement which has a diameter which is smaller than the diameter of the aperture and thereby capable of being routed therethrough. The fingers are expandable from the first arrangement to a second arrangement having a diameter greater than the diameter of the aperture. A spreader pin resides within the bore and within the fingers. The spreader pin is movable from a first position with the fingers at the first arrangement to a second position within the fingers to a second arrangement with the finger engaging surface in communication with the fingers. A handle, pivotally connected to the base member by a pivot; has an impact end which drives the spreader pin into the fingers upon rotation of the handle.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: September 14, 2004
    Assignee: Cool Options, Inc.
    Inventors: Jeffrey J. Panek, Peter D. Tata, James W. Carpenter
  • Patent number: 6783716
    Abstract: A new die insert for an extrusion machine and a method of using the invention that includes a continuous strand of fiber reinforcing material to be statically drawn directly to the center of the molten flow of polymer base matrix. The insert is placed in line with the discharge end of an injection molding apparatus. A molten flow of polymer base matrix proceeds in a straight linear fashion through the die. A fiber feed tube is centered on the interior of the die. As the polymer flows past the feed tube the molten polymer draws a continuous strand of fiber reinforcing into the center of the flow. The polymer is then extruded and cooled and the extrusion is further pelletized to produce injection molding feed stock material having continuous fiber reinforcing. The result provides a continuous extrusion process that allows the formation of a continuous fiber-reinforced product employing brittle fibers in one-step process.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: August 31, 2004
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Publication number: 20040115292
    Abstract: A new die insert for an extrusion machine and a method of using the invention that includes a continuous strand of fiber reinforcing material to be statically drawn directly to the center of the molten flow of polymer base matrix is provided. The insert is placed in line with the discharge end of an injection molding apparatus. A molten flow of polymer base matrix proceeds in a straight linear fashion through the die. A fiber feed tube is centered on the interior of the die. As the polymer flows past the feed tube the molten polymer draws a continuous strand of fiber reinforcing into the center of the flow. The polymer is then extruded and cooled and the extrusion is further pelletized to produce injection molding feed stock material having continuous fiber reinforcing. The result provides a continuous extrusion process that allows the formation of a continuous fiber-reinforced product employing brittle fibers in one-step process.
    Type: Application
    Filed: September 11, 2003
    Publication date: June 17, 2004
    Applicant: COOL OPTIONS, INC.
    Inventor: Kevin A. McCullough
  • Publication number: 20040104502
    Abstract: The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. In addition, an alternative embodiment of the composition mixture includes a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
    Type: Application
    Filed: September 3, 2003
    Publication date: June 3, 2004
    Applicant: COOL OPTIONS, INC.
    Inventor: Kevin A. McCullough
  • Publication number: 20040106702
    Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K. and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.
    Type: Application
    Filed: September 5, 2003
    Publication date: June 3, 2004
    Applicant: COOL OPTIONS, INC.
    Inventors: Kevin A. McCullough, James D. Miller, Mikhail Sagal
  • Patent number: 6710109
    Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Cool Options, Inc. a New Hampshire Corp.
    Inventors: Kevin A. McCullough, James D. Miller, E. Mikhail Sagal
  • Patent number: 6697561
    Abstract: A Variable Optical Attenuation Collimator (VOAC) is disclosed to achieve a variable degree of optical power attenuation through the collimator by adding an Attenuation Control Element (ACE) between a lens element and fiber pigtails of a traditional fiber optical collimator. The body of the ACE can be implemented in many different ways such as a polymer-network liquid crystal light scattering and absorbing material, a Refraction Index Gradient Controllable Material (RIGCM) capable of controllably swerving the direction of light propagation, a Refraction Index Controllable Material (RICM) capable of controllably defocusing an incident light power and a transparent Length Controllable Material (LCM) capable of controllably changing the spacing between the lens element and the fiber pigtails causing a defocusing of an incident light power.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: February 24, 2004
    Assignee: Global Option, Inc.
    Inventor: Yi He
  • Patent number: 6685855
    Abstract: A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 3, 2004
    Assignee: Cool Options, Inc.
    Inventors: James Miller, Kevin McCullough, E. Mikhail Sagal
  • Patent number: 6681487
    Abstract: The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: January 27, 2004
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6680015
    Abstract: A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely convecting through the part which makes it more efficient and has an optimal thermal configuration.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: January 20, 2004
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6620497
    Abstract: A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventors: Lyle James Smith, E. Mikhail Sagal, James D. Miller, Kevin McCullough
  • Patent number: 6620366
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6611660
    Abstract: An electric heater element, that is injection overmolded with a thermally conductive polymer having a thermal conductivity of at least 3 W/m° K, includes surface enhancements to increase the overall outer surface area of the element that is in contact with a fluid to be heated, thereby enhancing the efficiency of heat transfer into the fluid. The heater element has a solid core having a resistance heating element spirally wound about its outer surface. An outer covering is injection overmolded onto the core sealing the heating element and shielding it from the exterior environment. While the outer covering seals the heating element it also includes surface enhancements such as concentric fins, pins or discs that increase the contact surface area of the outer cover, further enhancing the heat transfer properties of the heating element.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: August 26, 2003
    Assignee: Cool Options, Inc. a New Hampshire corp.
    Inventor: E. Mikhail Sagal
  • Patent number: 6585039
    Abstract: The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6587330
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6557859
    Abstract: A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the mixture into a mold cavity. The gasket of the present invention provides superior sealing between the case sections of an electronic device by shielding the device from EMI infiltration along the seam between the sections. In addition, the gasket of the present invention is in thermal communication with the case sections of the electronic device to provide thermal transfer and dissipation between the separate parts of the device.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: May 6, 2003
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, James D. Miller, Mikhail Sagal
  • Patent number: 6543524
    Abstract: A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: April 8, 2003
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, E. Mikhail Sagal, James D. Miller
  • Patent number: 6540948
    Abstract: A method of overmolding a heat pipe includes providing an injection mold apparatus having a cavity, an input gate, a bleed off overflow gate in communication with the cavity and a tubular heat pipe charged with phase change media which is capable of being collapsed by imparting an external collapsing pressure. The tubular heat pipe is placed into the cavity in the injection mold apparatus. A net shape moldable thermally conductive material is introduced into the cavity and around the tubular pipe. The bleed off overflow gate is set to open at a predetermined pressure which less than the external collapsing pressure which would damage the heat pipe to be overmolded. Pressure is relieved in the cavity of the mold apparatus through the bleed off overflow gate when pressure in the bleed off overflow gate reaches the predetermined pressure. As a result, delicate heat pipes can be overmolded in an injection mold apparatus without damage to the heat pipe during the molding process.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: April 1, 2003
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6503964
    Abstract: A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: January 7, 2003
    Assignee: Cool Options, Inc.
    Inventors: Lyle James Smith, Mikhail Sagal, James D. Miller, Kevin A. McCullough
  • Patent number: 6487073
    Abstract: A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: November 26, 2002
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, E. Mikhail Sagal, James D. Miller