Abstract: A temperature compensated laser diode transmitter circuit includes a laser diode, a driver circuit for supplying an a.c. drive current to the laser diode, a thermistor arranged to thermally sense the laser diode, a current source having a first and a second current output controlled by the thermistor, the first current output connected to the driver for temperature compensating the drive current, and the second current output connected to supply a temperature compensated bias current to the laser diode.

Abstract: An optoelectronic module has an optoelectronic receiver or transmitter supported in optical alignment with optical fibers on a common substrate assembly. The module is optically prealigned and can be mounted through a hole in an enclosure containing transmitter or receiver circuits to make a complete optoelectronic package. The module may be hermetically and electromagnetically sealed to the enclosure. In one form of the invention, the optical fibers terminate at a rear face of the module, and the module can be coupled to a conventional fiber optic connector.

Abstract: An integrated mounting assembly has optical fibers supported between a grooved substrate and a clamping substrate, one or both substrates being mounted to a base substrate. The base substrate also provides integrated support for a submount which carries an optoelectronic device, e.g., a laser diode. Optical coupling of the device to the optical fibers is achieved by referencing the submount to the base without need for active optical alignment of the device. Mounting of the integrated optoelectronic assembly in a housing of an optoelectronic package can be made hermetic and electromagnetically shielded.