Patents Assigned to Optoelectronics, Inc.
  • Patent number: 11568525
    Abstract: A moiré image processing device is provided, including a light-transmitting film, a light sensor, and an image processor. The light-transmitting film includes a plurality of microlenses, and a light-incident surface and a light-exit surface, where the microlenses are disposed on the light-incident surface, the light-exit surface, or a combination thereof according to a distribution pattern. The light sensor includes a photosensitive surface, where the photosensitive surface faces the light-exit surface, there are a plurality of pixels on the photosensitive surface, and the pixels sense the microlenses to obtain a photosensitive image corresponding to the distribution pattern. The image processor is coupled to the light sensor, where the image processor performs, according to a virtual image and the photosensitive image, image processing of simulating a moiré effect to generate a moiré image, where the virtual image corresponds to the distribution pattern and is similar to the photosensitive image.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: January 31, 2023
    Assignee: inFilm Optoelectronic Inc.
    Inventor: Chih-Hsiung Lin
  • Patent number: 11552113
    Abstract: A moiré pattern imaging device includes a light-transmitting film and an optical sensor. The light-transmitting film includes a plurality of microlenses, and a light-incident surface and a light-exit surface opposite to each other. The plurality of microlenses are disposed on the light-incident surface, the light-exit surface or a combination thereof, and the plurality of microlenses are arranged in two dimensions to form a microlens array. The optical sensor includes a photosurface. The photosurface faces the light-exit surface of the light-transmitting film, the photosurface is provided with a plurality of pixels, and the plurality of pixels are arranged in two dimensions to form a pixel array. The microlens array and the pixel array correspondingly form a moiré pattern effect to produce an imaging magnification effect, and the photosurface of the optical sensor senses light and forms a moiré pattern magnification image.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: January 10, 2023
    Assignee: inFilm Optoelectronic Inc.
    Inventors: Chih-Hsiung Lin, Shih-Yuan Chang
  • Patent number: 11474311
    Abstract: A parabolic reflector device (also referred to herein as a parabolic lens device) is disclosed which includes a plurality of parabolic lens members and a mirror member which couple together and collectively provide a light-transmissive structure for multiplexing or demultiplexing of an optical signal. The parabolic reflector device can be implemented within optical subassembly modules to support operations of transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs).
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: October 18, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11456566
    Abstract: A coaxial seizure assembly is disclosed that includes an integrated mechanical stop that prevents over-insertion and maintains a nominal/expected impedance value to enable high-frequency switching, e.g., 1.8-3 Ghz or greater. In more detail, the coaxial seizure assembly includes a coaxial receptacle defined by an opening configured to at least partially receive and couple to a coaxial connector. The opening communicates with a seizure cavity defined within the coaxial seizure assembly. A radio frequency (RF) interconnect at least partially extends into the seizure cavity, with the RF interconnect having a first end to electrically couple to an electrical component and a second end that extends a predetermined angle relative to the first end, e.g., substantially 90 degrees. The second end defines a mating surface that aligns within the seizure cavity such that an imaginary line drawn along an insertion path of a coaxial cable conductor pin intersects with the mating surface.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: September 27, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: William G. Mahoney, Simon Farfoud
  • Patent number: 11411650
    Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Kevin Liu, Hao-Chiang Cheng
  • Patent number: 11404210
    Abstract: The present disclosure is generally directed to utilizing capacitors stacks with capacitors mounted in a terminal-to-terminal mounting orientation to reduce overall footprint of capacitor arrays for bypass filtering circuits. In an embodiment, each capacitor stack includes at least a first capacitor, a second capacitor, and a ground plane interconnect. The first capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mating surface to couple to the second capacitor, the second terminal couples to a ground plane. The second capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mounting surface to electrically couple to and support the first capacitor, and the second terminal provides a mating surface to electrically and physically couple to the ground plane. Accordingly, the first capacitor can be inverted and mounted atop the second capacitor to eliminate the necessity of wire bonds, for example.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: August 2, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Yi Liu, Qin Li, Hsiu-Che Wang, Ruru Chen
  • Patent number: 11320598
    Abstract: The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: May 3, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11320601
    Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 3, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, John Cheng, Ziliang Cai
  • Patent number: 11289875
    Abstract: In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: March 29, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hang Xie, Ming Qi
  • Publication number: 20220020798
    Abstract: A moiré pattern imaging device includes a light-transmissive film and a light-shielding film. The light-transmissive film includes a plurality of imaging units and a light-incident surface and a light-emergent surface opposite to each other. The plurality of imaging units are disposed on the light-incident surface, the light-emergent surface, or a combination thereof and are arranged in two dimensions to form an imaging unit array. The light-shielding film includes a plurality of light-transmissive regions. The light-transmissive regions are arranged in two dimensions to form a light-transmissive array, and the light-shielding film is overlaid on the light-incident surface or the light-emergent surface. The light-transmissive array corresponds to the imaging unit array. The imaging unit array and the light-transmissive array together form a moiré pattern effect to generate an image magnification effect.
    Type: Application
    Filed: June 4, 2021
    Publication date: January 20, 2022
    Applicant: inFilm Optoelectronic Inc.
    Inventors: Chih-Hsiung LIN, Jung-Ping LIU
  • Patent number: 11226589
    Abstract: A holographic image film, and a holographic image recording method and reconstruction method are provided. The holographic image recording method includes a preparation step, an irradiation step and a recording step. The preparation step includes stacking a holographic negative film on a transparent substrate. The irradiation step includes emitting object light and reference light. The reference light is emitted into the transparent substrate and undergoes multiple times of total reflections in a thickness of the transparent substrate to form total internal reflected light. The recording step includes generating a holographic image interference line by a mutual interference between the total internal reflected light and the object light, and recording the holographic image interference line on the holographic negative film in a photosensitive manner.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: January 18, 2022
    Assignee: inFilm Optoelectronic Inc.
    Inventors: Chih-Hsiung Lin, Chih-Chieh Chang
  • Patent number: 11221460
    Abstract: The present disclosure is generally directed to a lens clip that defines at least one mounting surface for coupling to and supporting an array of optical components, e.g., a laser diode and associated components, and an optical lens slot to receive and securely hold an array of optical lenses at a predetermined position relative to the optical components to ensure nominal optical coupling. The optical lens slot includes dimensions that permit insertion of each optical lens into the same and restrict travel along one or more axis. Accordingly, disposing an optical lens within the lens slot ensures correct alignment along at least two axis, e.g., Z and X, with the third axis (e.g., Y) extending parallel along the slot to permit lateral adjustment of each lens.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: January 11, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Hsiu-Che Wang, Qin Li
  • Patent number: 11209294
    Abstract: A thin proximity sensing device includes a transparent plate and a light sensor. The transparent plate includes a first surface and a second surface. The first surface is provided with a light source and a light entering area. The light source is arranged on the first surface. The second surface is provided with a reflector. The light sensor includes a light receiving area. The light sensor is arranged on the transparent plate. The reflector is capable of correspondingly reflecting specific incident light. The specific incident light refers to light that enters the transparent plate through the light entering area on the first surface after the light emitted by the light source is reflected externally, and is incident to the reflector. After reflected by the reflector, the specific incident light is reflected one or more times within the thickness of the transparent plate and is transmitted to the light sensor.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: December 28, 2021
    Assignee: inFilm Optoelectronic Inc.
    Inventors: Chih-Hsiung Lin, Shih-Yuan Chang
  • Patent number: 11177887
    Abstract: The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 16, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hang Xie, Yi Wang
  • Patent number: 11146039
    Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: October 12, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hsiu-Che Wang, Ziliang Cai
  • Patent number: 11057112
    Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Hang Xie
  • Patent number: 11054592
    Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11047561
    Abstract: The present invention relates to a heat sink structure and a flexible light-emitting device with heat sink structures. The heat sink structure according to the present invention dissipates heat through a heat sink part. A hooking part on one end of the heat sink structure hooks a fixing part of another heat sink structure for forming flexible and bendable heat sink structures. Bending the heat sink structures gives a first nonlinear structure. The flexible light-emitting device can be disposed on the heat sink structures. The heat generated by the flexible light-emitting device can be removed by the heat sink structures. The heat sink structures can adapt to lamps with various designs. Then the design freedom and reliability of lamps can be improved.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: June 29, 2021
    Assignee: Excellence Optoelectronics Inc.
    Inventors: Pin-Chu Chen, Yi-Jing Huo, Sheng-Hua Yang
  • Publication number: 20210183031
    Abstract: A moiré image processing device is provided, including a light-transmitting film, a light sensor, and an image processor. The light-transmitting film includes a plurality of microlenses, and a light-incident surface and a light-exit surface, where the microlenses are disposed on the light-incident surface, the light-exit surface, or a combination thereof according to a distribution pattern. The light sensor includes a photosensitive surface, where the photosensitive surface faces the light-exit surface, there are a plurality of pixels on the photosensitive surface, and the pixels sense the microlenses to obtain a photosensitive image corresponding to the distribution pattern. The image processor is coupled to the light sensor, where the image processor performs, according to a virtual image and the photosensitive image, image processing of simulating a moiré effect to generate a moiré image, where the virtual image corresponds to the distribution pattern and is similar to the photosensitive image.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 17, 2021
    Applicant: inFilm Optoelectronic Inc.
    Inventor: Chih-Hsiung LIN
  • Patent number: 11022765
    Abstract: The present disclosure is generally directed to a lens clip that includes an optical lens slot to securely hold an optical lens at a predetermined position to mitigate effects of post-annealing shift. The lens clip includes a base that provides at least one substrate mating surface for mounting to a substrate, and at least first and second arms extending from the base. The first and second arms extend substantially parallel relative to each other and define at least a portion of an optical lens slot. The optical lens slot is configured to receive at least a portion of an optical lens and securely hold the optical lens at a predetermined position to ensure optical alignment of the optical lens, e.g., relative to an associated laser diode or other optical component, during fixation of the optical lens to the substrate using, for instance, UV-curing optical adhesives.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: June 1, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Chong Wang, Qin Li, Hsiu-Che Wang