Patents Assigned to Optoelectronics Systems Consulting Inc.
  • Publication number: 20140353791
    Abstract: This invention describes a hermetically sealed package which can be implanted in the body. The package comprise of stacked substrates where surface of one substrate hosts biosensors which are exposed to body fluids to monitor concentrations of substances selected from analytes, metabolites, and proteins, and body physiological parameters. The structure protects from body fluids devices that interface with the biosensor electrodes for electronic data processing, powering, and wireless communication. Biosensor electrodes are electrically connected to various electronic, optoelectronic, MEM devices using novel partial silicon vias (PSVs) that prevents leakage of body fluids. Various devices are located on different substrates which are stacked to save surface area. One of the substrate forms the cover plate which permits light for powering as well as sending receiving coded data including the analyte levels.
    Type: Application
    Filed: August 18, 2014
    Publication date: December 4, 2014
    Applicant: Optoelectronics Systems Consulting, Inc.
    Inventors: Faquir Jain, Fotios Papadimitrakopoulos
  • Publication number: 20130320476
    Abstract: An implantable, miniaturized platform and a method for fabricating the platform is provided, where the e platform includes a top cover plate and a bottom substrate, top cover plate including an epitaxial, Si-encased substrate and is configured to include monolithically grown devices and device contact pads, the Si-encased substrate cover plate including a gold perimeter fence deposited on its Si covered outer rim and wherein the bottom substrate is constructed of Si and includes a plurality of partial-Si-vias (PSVs), electronic integrated circuits, device pads, pad interconnects and a gold perimeter fence, wherein the device pads are aligned with a respective device contact pad on the top cover plate and includes gold bumps having a predetermined height, the top cover plate and the bottom substrate being flip-chip bonded to provide a perimeter seal and to ensure electrical connectivity between the plurality of internal devices and at least one external component.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 5, 2013
    Applicant: Optoelectronics Systems Consulting, Inc.
    Inventor: Optoelectronics Systems Consulting, Inc.
  • Patent number: 7326303
    Abstract: This invention describes an apparatus, Scanning Localized Evaporation Methodology (SLEM) for the close proximity deposition of thin films with high feature definition, high deposition rates, and significantly improved material economy. An array of fixed thin film heating elements, each capable of being individually energized, is mounted on a transport mechanism inside a vacuum chamber. The evaporable material is deposited on a heating element. The SLEM system loads the surface of heating elements, made of foils, with evaporable material. The loaded thin film heating element is transported to the substrate site for re-evaporation. The re-evaporation onto a substrate, which is maintained at the desired temperature, takes place through a mask. The mask, having patterned openings dictated by the structural requirements of the fabrication, may be heated to prevent clogging of the openings. The translation of the substrate past the evaporation site permits replication of the pattern over its entire surface.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: February 5, 2008
    Assignee: Optoelectronics Systems Consulting Inc.
    Inventors: Fotios Papadimitrakopoulos, Thomas Samuel Phely-Bobin, Daniel Harrison Grantham, deceased, Faquir C Jain