Patents Assigned to OPTOSYS TECHNOLOGIES GMBH
  • High-density multichip module and method for manufacturing the same
    Publication number: 20030015803
    Abstract: Multichip modules with stacked semiconductor chips, in particular non-volatile memory chips,.are provided that have peripherally arranged bonding pads. The semiconductor chips have identical dimensions and are spaced apart by spacers of smaller dimensions that prevent the chip from directly contacting each other and allow wire-bonding of each of the stacked chips to the bonding pads. The chips are preferably nude chips. A method for mounting the chips is also disclosed.
    Type: Application
    Filed: July 16, 2002
    Publication date: January 23, 2003
    Applicant: OPTOSYS TECHNOLOGIES GMBH
    Inventor: Dieter Prietzsch