Abstract: A high density array of light emitting diodes for visual display and imaging purposes. The array is mounted on a thermally and electrically conducting medium such as an aluminum block. The block, in one embodiment, is configured to permit a supplementary cooling liquid to be circulated through it. Typically, such LED arrays are fabricated by forming a plurality of p-type islands in n-type host semiconductor material. Each p-type island has an individually addressable contact and a common n-type contact is made to the aluminum block by, for example an electrically conductive epoxy. In operation the connection between the carrier and array may be lost due to a temperature differential between the two components. The present invention avoids this problem by providing a separate connection in parallel with or in place of the common n-type contact.