Patents Assigned to Orbit Semicon LTD.
  • LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF
    Publication number: 20110241026
    Abstract: A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided.
    Type: Application
    Filed: March 22, 2011
    Publication date: October 6, 2011
    Applicant: Orbit Semicon LTD.
    Inventors: HUNG-NAN CHEN, Wen-Hao Cheng