Abstract: The invention is a method of producing a chip module for use with a smart card. The chip module is mounted in the smart card and has contacts for communicating with external appliances. The contacts of the chip module include at least two layers which are acted upon by a laser beam to fuse the at least two layers forming an alloy. The alloy forms a pattern of visible information on the contacts.

Abstract: A system for processing chip and/or magnetic strip cards (K), comprising at least one card supply magazine for accommodating cards to be processed; at least a chip and/or magnetic stripe processing station for applying data/information on the chip and/or the magnetic stripe of the cards (I), with a certain chip and/or magnetic stripe processing time being associated with the station; at least one card body processing station for applying data/information on the card body, with a certain card body processing time being associated with the station; a card transport system which transports the cards from the card supply magazine to the chip and/or magnetic stripe processing station and subsequently to the card body processing stations and from these onwards, wherein the processing time of the at least one chip and/or magnetic stripe processing station differs from the processing time of the at least one card body processing station, and the card transport time from the card supply magazine to one of the processi

Abstract: A unit for processing chip and/or magnetic stripe cards. The unit comprises a minimum of one card storage magazine to store cards to be processed, a minimum of one chip and/or magnetic stripe processing station to record data on the chip (semiconductor element) and/or the magnetic stripe of the card, and a minimum of one card body processing station to record visible, unmodifiable data on the card body. The unit further includes an optical identification station with an evaluation unit to verify accuracy and/or quality of the data recorded on the card body, with cards exhibiting incorrectly or defectively applied visible data being rejected as defective.

Abstract: A method for manufacturing a chip card comprising a multi-layer plastic card body; an integrated circuit arranged within a chip module; at least one coil which serves for the energy supply and/or the data exchange between the integrated circuit with external devices, with the chip module having at least two metallic contacts for an electrically conducting connection of the integrated circuit with the terminals of the coil arranged on a coil carrier layer, comprising the steps of: providing the coil carrier layer with the coil and the coil terminals being arranged on same; providing a cover layer to be applied onto the coil carrier layer on the side of the coil terminals, with the cover layer comprising recesses which correspond to the coil terminals; providing at least one thickness compensation layer to be applied onto the cover layer; stacking of the card layers in registered relationship, with the cover layer being positioned in such a manner that each of the recesses in the cover layer comes to lie in the

Abstract: A pass card having a card body with a cavity therein, a module with a semiconductor chip implanted permanently in the cavity of the card body, and a micro-encapsulated adhesive for fixing a nonconductive plastic substrate of the module in the card body.

Abstract: A plastic card includes a minichip card separably held in a carrier card. First and second separate and discrete breaking regions connect the minichip card to the carrier card along an outer contour of the minichip card. A gap separates a remainder of the outer contour of the minichip card from the carrier card. A breaking line on the carrier card, which has a higher flexibility than the rest of the carrier card, is interrupted by the gap and is closer to the first breaking region than to the second breaking region. When the carrier card is bent along the breaking line, the first breaking region separates, thereby leaving the minichip card attached to the carrier card by the second breaking region only. To fully separate the minichip card from the carrier, the minichip card is pivoted relative to the carrier card along the second breaking region until the second breaking region separates.

Abstract: An identity card, especially a credit card, having a picture section, which contains a photo of the card holder. In this section, pixels of different absorptions, especially the gray and black parts, are burned by a laser beam point-by-point into a surface layer and/or an intermediate layer located below a transparent surface layer of the identity card. In addition, a colored part is applied, particularly using the thermal transfer process, which covers the same area as the image. Security features can also be introduced into the image division.