Abstract: A clip for clamping a heat sink and a semiconductor chip together on a main board of a computer is disclosed, in which a semiconductor chip such as a CPU of a computer is coupled with a heat sink by means of the clamping clip, for releasing the generated heat of the semiconductor chip. Particularly, a clip for clamping a heat sink and a semiconductor chip together on a main board of a computer is disclosed, in which a fixing clip having left and right bent segments is used, and the heat sink is elastically fixed to the main board of a computer by means of the clamping clip, so that an external impact cannot cause the heat sink to detach from the main board of the computer. Thus a single clip is used in elastically fixing the heat sink and the semiconductor chip to the main board in an easy manner, that is, four pins protruding to under the bottom of the main board are fixed by means of a single clip, thereby realizing a sure and firm fixing.

Abstract: A thermal and current sensing switch which brakes an associated electric circuit when an overcurrent is supplied to the electric circuit or the temperature of the electric apparatus rises beyond a predetermined temperature. The thermal and current sensing switch comprises a housing, fixed conductors fixed to the housing with the base ends thereof extended within the housing; a current fuse placed in the housing with the opposite terminals thereof in contact with the fixed conductors; a first spring biasing the current fuse away from the fixed conductors, a second spring pressing the current fuse against the fixed conductors against the force of the first spring, and a temperature sensing element provided between the housing and the second spring. When the ambient temperature rises beyond a predetermined temperature, the temperature sensing element reduces the force of the second spring to allow the first spring to separate the current fuse from the fixed conductors to break the electric circuit.