Abstract: An integrated circuit for interfacing with one or more sensors including a wireless interface configured to connect to a network, an I/O interface configured to connect to sensors; and a microprocessor and memory that are programmed to: connect to a server via the network, wherein the server executes an application for controlling the sensors; transmit identification information and/or location information of the integrated circuit to the application executed by the server; receive commands for the sensors from the application executed by the server; and transfer the commands to the I/O interface for relaying to the sensors; and wherein the integrated circuit is configured to control any sensor that can connect electronically to the I/O interface without changing the programming of the microprocessor and memory.

Abstract: An integrated circuit for interfacing with one or more sensors, including a wireless interface configured to connect to a network, an I/O interface configured to connect to sensors; and a microprocessor and memory that are programmed to: connect to a server via the network; wherein the server executes an application for controlling the sensors; transmit identification information and/or location information of the integrated circuit to the application executed by the server; receive commands for the sensors from the application executed by the server; and transfer the commands to the I/O interface for relaying to the sensors; and wherein the integrated circuit is configured to control any sensor that can connect electronically to the I/O interface without changing the programming of the microprocessor and memory.

Abstract: A method of forming an integrated circuit, including providing a first substrate layer having a center piece and two side pieces on opposite sides of the center piece, assembling one or more circuit elements on a top side and a bottom side of the center piece of the first substrate layer, preparing two support pieces from a substrate, matching the size of the side pieces, coupling the support pieces to the bottom of the first substrate layer under the side pieces to form a second substrate layer with a void in the center under the center piece of the first substrate layer; and wherein the side pieces and support pieces include via connectors electrically connecting between a bottom side of the second substrate layer and the circuit elements.

Abstract: A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.

Abstract: A method of embedding rigid elements in a windshield, including, cutting two sheets of glass in a desired shape to serve as an upper layer and lower layer of the windshield, inserting a layer of interlayer material for each of the two layers of glass, facing each other, between the two layers of glass, placing the rigid elements between the two layers of interlayer material, pushing the two layers of glass together to form a glass sandwich with the rigid elements and two layers of interlayer material between the upper and lower glass layers, heating the glass sandwich while applying pressure to form a unified sheet of glass; and wherein the combined thickness of the layers of interlayer material is at least as thick as the rigid elements.

Abstract: A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.

Abstract: The present invention, relates to the preparation of a patch antenna with a specific effective dielectric constant; and a reduced dissipation factor. In an exemplary embodiment of the invention, size requirements and the desired resonant signal frequency dictate the permittivity value of the dielectric material to be used between the patch plate and the ground plate. Instead of using a dielectric material with the calculated permittivity value and its given dissipation factors a two layer dielectric of the same size with an effective dielectric constant that is equal to the desired dielectric constant, is used to replace the dielectric material and reduce the dissipation factor.

Abstract: A circuit with an integral antenna, including a hybrid circuit on a substrate, a patch antenna that is adapted to be positioned at a pre-selected distance above the hybrid circuit and coupled to the hybrid circuit to form a single physical unit, a feeder that electronically connects between the hybrid circuit and the patch antenna.