Abstract: Method and apparatus for edge location analysis preliminary to sewing on a separate computerized sewing apparatus including scanning an object to be sewn by moving it under a scanning assembly in accordance with a predetermined sewing path to provide true edge location data, comparing the true edge location data with the expected edge locations to determine any deviations, and sewing the object using the predetermined sewing path as modified by the true edge locations data.
Type:
Grant
Filed:
August 27, 1990
Date of Patent:
April 27, 1993
Assignee:
Orisol Ltd.
Inventors:
Yaacov Sadeh, Yaacov Makover, Bar C. Mardix