Abstract: The present invention provides a wire saw for use in cutting works of electronics materials or optical materials and a method for manufacturing the same, said wire saw having the following characteristic features. Namely, onto a high-strength core wire 2, abrasive grains 3 having a grain size not smaller than two-thirds the thickness of a layer of resin bond 4 on said core wire 2 but not exceeding a half the diameter of said core wire are fixed with said resin bond, said resin bond containing a filler having a grain size smaller than two-thirds the thickness of said resin bond layer. The thus structured and arranged wire saw has an improved efficiency and precision in cutting. The wire saw can be manufactured readily by using an enamelling oven.

Abstract: The present invention provides a superhard film-coated member having a diamond or diamond-like carbon film strongly bonded to a cemented carbide substrate and a method of manufacturing such a member. The cemented carbide substrate is subjected to heat treatment to cause the bonding metal in a region of the substrate near to its surface to migrate to the surface so as to form hemispherical deposits thereon. The deposits are left undisturbed or a part or all thereof are removed, and subsequently diamond and/or diamond-like carbon is grown on the substrate surface by a chemical vapor deposition process. The deposits formed on the substrate surface have the effect of significantly improving the bonding strength between the superhard films and the cemented carbide substrate to allow formation of thicker film coatings.

Abstract: A method is provided for efficiently producing an entirely quality-controlled CVD diamond. A CVD process is interrupted at an early stage and the deposit is taken out of the reaction chamber, before a significant mass is accumulated, and is inspected by means of cathodoluminescence. The spectrum are compared with a given reference in terms of peak position, half width and 20%-value width in coordination. The observed deviation allows to determine whether to maintain or alter the settings.A diamond substance of acceptable quality which is properly specified in terms of the CL parameters is also provided.

Abstract: Making a diamond substance exhibiting a cathodoluminescence spectrum with the peak at a photon energy greater than 2.8 eV (electron volt), the half-value and 20%-value width not exceeding 0.5 eV and 0.8 eV, respectively, comprising: providing a substrate in a closed chamber, introducing a matrix gas comprising H.sub.2 and one selected from hydrocarbon and CO to said chamber, exciting the gas to create a plasma while heating said substrate to a temperature of at least 700.degree. C. and, thus, causing deposition and growth of diamond substance which is crystallographically diamond, controlling parameters of the deposition by means of the cathodoluminescence record and recovering the diamond substance from the chamber.

Abstract: A rotary blade has a rotary substrate with chips disposed about the outer edge of the substrate. The substrate further has two sets of semicircular slits. The first set of semicircular slits is disposed annularly about the rotary substrate on a circle coaxial with the center of rotation of the rotary blade. The semicircular slits open toward the center of rotation. The second set of semicircular slits are disposed on a circle inside of the circle of first slits. These slits open outwardly, thus blocking, at least partially, the first semicircular slits from the center of rotation. A filler material is filled into the semicircular slits, the slits thus providing a vibration damping effect. The chips may be attached to the outer edge of the rotary substrate by concave profiled cassette stands.

Abstract: An improved wire saw having a wire rope, a resilient layer covering the outer periphery of the wire rope, and a plurality of sleeves mounted on the wire rope through the resilient layer at spacings, the sleeves having an abrasive layer on their outer periphery. The resilient layer has a smaller outer diameter at portions between the sleeves than over and adjacent to the sleeves. The sleeves or the resilient layer is provided with an engaging portion to axially extend to prevent one of them from turning with respect to the other.