Abstract: The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing of the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises depositing a first cladding layer on an upper surface of a silicon substrate; depositing a core layer; depositing a resist mask pattern to define a form of a ring resonator core and a form of a waveguide core; etching the core layer outside of the resist mask pattern; and stripping the resist mask pattern off.