Patents Assigned to Oshika Shinko Co., Ltd.
  • Patent number: 5459207
    Abstract: Disclosed are a resorcinol resin adhesive composition which comprises a resorcinol resin modified by m-aminophenol, and a process for bonding wood materials by using the same.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: October 17, 1995
    Assignee: Oshika Shinko Co., Ltd.
    Inventors: Yuki Saigan, Mitsutoshi Ogawa
  • Patent number: 5405705
    Abstract: There is disclosed a method for preparing a resin-reinforced decorative board which comprises the steps of interposing a polymerizable gelatinous substance between a decorative veneer and a base board, pressurizing and heating the materials to permeate at least part of components constituting the gelatinous substance to the decorative veneer or both of the decorative veneer and the base board, and polymerizing the substance to laminate the decorative veneer and the base board through an adhesive layer.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: April 11, 1995
    Assignees: Oshika Shinko Co., Ltd., Kuraray Co., Ltd.
    Inventors: Masaru Fujimoto, Masami Kondo, Michio Chatani, Tadayuki Tsuchiya
  • Patent number: 5223587
    Abstract: Disclosed is an adhesive composition for wood comprising a phenol resin adhesive and a phenol resin highly condensed in a mole ratio (F/P) of formaldehyde (F) to a phenol (P) in the range of 0.8:1 to 1.5:1, having a softening point of 100.degree. to 200.degree. C. and having a number average molecular weight of 2,000 or more, whereby the adhesive is accelerated in hardening to impart fast setting-ability thereto, which causes the pressing temperature to be reduced and makes it possible to raise the allowable moisture content of adherends.
    Type: Grant
    Filed: August 7, 1992
    Date of Patent: June 29, 1993
    Assignee: Oshika Shinko Co. Ltd.
    Inventor: Natsuhi Tsuruta
  • Patent number: 5200458
    Abstract: An adhesive composition can be provided which comprises a vinyl acetate polymer emulsion containing acetoacetylated polyvinyl alcohol as a protective colloid and a calcium silicate alone or the calcium silicate and an isocyanate compounded therein, which can solve the disadvantages observed in the adhesives of systems in which the isocyanates are added to the emulsions like the prior art, and which retains the adhesive strength for a long time, particularly has a little reduction in initial adhesive strength, and is excellent in water resistance (water-resistant adhesion) and also in heat resistance (heat-resistant adhesion) compared to those of the prior-art adhesives.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: April 6, 1993
    Assignee: Oshika Shinko Co., Ltd.
    Inventors: Masaharu Iwasaki, Takashi Yonehara, Hiroyasu Morinaga, Satoshi Okajima, Katsuhiro Koda
  • Patent number: 4307206
    Abstract: A urea-formaldehyde resin adhesive comprising a powder of a substance having the property of gradually reacting with an acid and thus consuming the acid.
    Type: Grant
    Filed: July 7, 1980
    Date of Patent: December 22, 1981
    Assignees: Oshika Shinko Co., Ltd., Mitsuo Higuchi, Isao Sakata
    Inventors: Mitsuo Higuchi, Isao Sakata