Patents Assigned to Osram Opto Semiconductors GmbH & Co.
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Patent number: 6570896Abstract: A laser radiation source is provided with an array of N individual slave laser diodes in a predetermined surface area. Adjustable power supply networks enable adjustment of the slave laser diodes relative to one another for operation in a stable manner. The slave power supply has a separate power supply network for each slave laser diode. Each of the power supply networks can be adjusted with respect to the current supplied to the respective slave laser diode during a certain operating period. This enables adjusting the slave laser diodes relative to one another. The power supply networks can be connected in parallel and supplied by a common source.Type: GrantFiled: June 5, 2001Date of Patent: May 27, 2003Assignees: Deutsches Zentrum fuer Luft-und Raumfahrt e.V., Osram Opto Semiconductors GmbH & Co. oHG, Universitaet Stuttgart Institut fuer StrahlwerkzeugeInventors: Norbert Bissinger, Uwe Brauch, Guido Hergenhan, Hans Opower, Marcus Scholl, Bernd Luecke, Werner Spaeth
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Patent number: 6560857Abstract: An assembly device, in particular a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries, comprising an assembly table, a material transport system that transports the products to be placed with components, at least one transport system mounted on the assembly table, and at least one movable component transport unit with at least one assembly head. The component transport unit(s) is/are arranged on one or more carrier system(s) displaceable by means of a transport system in parallel to the direction of transport of the products to be placed with components, which products are in turn displaced by the material transport system(s).Type: GrantFiled: May 10, 2001Date of Patent: May 13, 2003Assignees: Simotech GmbH, Osram Opto Semiconductors GmbH & Co. OHGInventors: Günter Waitl, Johann Feraric
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Patent number: 6518601Abstract: A light-emitting diode (1) comprises a window layer (4) above an active layer (3), the window layer having edge webs (6) profiled in a sawtooth-shaped manner. Edge lines (11) with which the current is injected into the active layer (3) proceed above the edge webs (6). The light-emitting diode (1) is distinguished by an especially high output efficiency.Type: GrantFiled: November 30, 2000Date of Patent: February 11, 2003Assignee: Osram Opto Semiconductors GmbH & Co. oHGInventor: Ralph Wirth
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Publication number: 20030025170Abstract: A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.Type: ApplicationFiled: September 27, 2002Publication date: February 6, 2003Applicant: Osram Opto Semiconductors GmbH & Co. OHGInventor: Karlheinz Arndt
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Patent number: 6504179Abstract: A white-emitting luminescence conversion LED uses a chlorosilicate phosphor which, in addition to Ca and Mg, contains a europium doping, and also a garnet phosphor of the rare earths, in particular Y and/or Tb. In this way, it is possible to achieve a high color rendering and a high constancy of the lighting properties under differing temperature conditions.Type: GrantFiled: January 17, 2002Date of Patent: January 7, 2003Assignees: Patent-Treuhand-Gesellschaft fur elektrische Gluhlampen mbH, OSRAM Opto Semiconductors GmbH & Co. OHGInventors: Andries Ellens, Frank Jermann, Franz Kummer, Michael Ostertag, Franz Zwaschka
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Patent number: 6475819Abstract: A method for the production and formation of microscopic semiconductor light emitting diodes Is set out. The method comprises the steps of: producing a semiconductor light emitting device (100) including a pn-junction (24) and metallization layers (6, 7); applying an etching mask (9-11) with a preset structure on one side of the semiconductor device (100), whereby the masked areas of the arrangement form and correspond to the diodes to be formed (30); applying a carrier (8, 12) on the other side of the semiconductor device (100); vertically etching the semiconductor material in the openings of the etching mask (9-11) to the carrier (8, 12) and thereby producing a diode arrangement containing a multiple number of diodes (30) below the masked areas.Type: GrantFiled: December 29, 2000Date of Patent: November 5, 2002Assignee: Osram Opto Semiconductors GmbH & Co. OHGInventor: Gerhard Franz
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Patent number: 6469321Abstract: A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.Type: GrantFiled: February 5, 2002Date of Patent: October 22, 2002Assignee: Osram Opto Semiconductors GmbH & Co. OHGInventor: Karlheinz Arndt
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Patent number: 6445010Abstract: The radiation emitting optoelectronic component has a radiation generating body with a planar optical waveguide and a wave guiding layer. The wave guiding layer has a radiation generating zone in which electromagnetic radiation is generated while the component is operating. The planar optical waveguide has at least one lateral output taper for outputting the radiation from the waveguide.Type: GrantFiled: December 27, 1999Date of Patent: September 3, 2002Assignee: Osram Opto Semiconductors GmbH & Co. OHGInventor: Karl Joachim Ebeling
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Publication number: 20020089047Abstract: A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.Type: ApplicationFiled: February 5, 2002Publication date: July 11, 2002Applicant: Osram Opto Semiconductors GmbH & Co. OHGInventor: Karlheinz Arndt
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Patent number: 6399473Abstract: A II-VI semiconductor component is produced with an active layer sequence having at least one II-VI semiconductor layer containing Se and/or S on a substrate. First, an Se-free II-VI interlayer based on BeTe is grown epitaxially on the substrate in an essentially Se-free and S-free first epitaxy chamber. The active layer sequence is then grown epitaxially on the Se-free II-VI semiconductor layer.Type: GrantFiled: January 10, 2000Date of Patent: June 4, 2002Assignee: Osram Opto Semiconductors GmbH & Co. oHGInventors: Frank Fischer, Matthias Keller, Thomas Litz, Gottfried Landwehr, Hans-Jürgen Lugauer, Andreas Waag, Markus Keim
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Patent number: 6396081Abstract: Light source (1) for generating visible light (200), comprising at least one diode (10) on a semiconductor basis emitting ultraviolet light (100) and at least one luminophor (20) into which the emitted ultraviolet light (100) beams and which generates the visible light from the emitted ultraviolet light (100). Application: Generation of white light offering especially high color fidelity.Type: GrantFiled: April 2, 2001Date of Patent: May 28, 2002Assignee: Osram Opto Semiconductor GmbH & Co. OHGInventors: Helmut Tews, Robert Averbeck, Henning Riechert
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Patent number: 6376902Abstract: An optoelectronic structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.Type: GrantFiled: January 31, 2000Date of Patent: April 23, 2002Assignee: Osram Opto Semiconductors GmbH & Co. oHGInventor: Karlheinz Arndt
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Publication number: 20020000514Abstract: A method for a quantitative detection of a linear movement or rotary movement. The method includes the steps of emitting radiation from at least two light emitters in a pulsed mode at a same clock frequency or different clock frequencies and detecting the radiation from the two light emitters by a detection device. It furthermore includes the steps of increasingly shadowing the radiations by a movable grid device or separating signals originating from different light emitters by an evaluation circuit coupled to said detection device.Type: ApplicationFiled: August 23, 2001Publication date: January 3, 2002Applicant: Osram Opto Semiconductors GmbH & Co. OHGInventors: Heinz Haas, Martin Haushalter, Frank Mollmer
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Publication number: 20010045647Abstract: The wavelength-converting casting composition is based on a transparent epoxy casting resin with a luminous substance admixed. The composition is used in an electroluminescent component having a body that emits ultraviolet, blue or green light. An inorganic luminous substance pigment powder with luminous substance pigments is dispersed in the transparent epoxy casting resin. The luminous substance is a phosphororous group of the general formula A3B5X12:M, and the luminous substance pigments have particle sizes ≦20 &mgr;m and a mean grain diameter d50≦5 &mgr;m.Type: ApplicationFiled: December 6, 2000Publication date: November 29, 2001Applicant: OSRAM OPTO SEMICONDUCTORS GmbH & Co., OHGInventors: Klaus Hhn, Alexandra Debray, Peter Schlotter, Ralf Schmidt, J?uuml;rgen Schneider
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Publication number: 20010030326Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversation element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.Type: ApplicationFiled: April 9, 2001Publication date: October 18, 2001Applicant: Osram Opto Semiconductors GmbH & Co. OHG, a Germany corporationInventors: Ulrike Reeh, Klaus Hohn, Norbert Stath, Gunter Waitl, Peter Schlotter, Jurgen Schneider, Ralf Schmidt
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Patent number: 6299337Abstract: The invention describes a flexible multiple LED module having a plurality of rigid printed circuit boards, which are each connected at one of their main surfaces to a flexible printed circuit board with a spacing between one another, and a plurality of LEDs, which are mounted in the region of the rigid printed circuit boards on the flexible printed circuit board. The multiple LED module is suitable particularly for installation in luminaire housings, in particular for motor vehicles.Type: GrantFiled: March 6, 2000Date of Patent: October 9, 2001Assignee: Osram Opto Semiconductors GmbH & Co. oHGInventors: Bernhard Bachl, Günter Waitl
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Patent number: 6277301Abstract: The wavelength-converting casting composition is based on a transparent epoxy casting resin with a luminous substance admixed. The composition is used in an electroluminescent component having a body that emits ultraviolet, blue or green light. An inorganic luminous substance pigment powder with luminous substance pigments is dispersed in the transparent epoxy casting resin. The luminous substance is a phosphorous group of the general formula A3B5X12:M, and the luminous substance pigments have particle sizes ≦20 &mgr;m and a mean grain diameter d50≦5 &mgr;m.Type: GrantFiled: March 28, 2000Date of Patent: August 21, 2001Assignee: Osram Opto Semiconductor, GmbH & Co. oHGInventors: Klaus Höhn, Alexandra Debray, Peter Schlotter, Ralf Schmidt, Jürgen Schneider
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Patent number: 6245259Abstract: The wavelength-converting casting composition is based on a transparent epoxy casting resin with a luminous substance admixed. The composition is used in an electroluminescent component having a body that emits ultraviolet, blue or green light. An inorganic luminous substance pigment powder with luminous substance pigments is dispersed in the transparent epoxy casting resin. The luminous substance is a powder of Ce-doped phosphors and the luminous substance pigments have particle sizes ≦20 &mgr;m and a mean grain diameter d50≦5 &mgr;m.Type: GrantFiled: August 29, 2000Date of Patent: June 12, 2001Assignee: Osram Opto Semiconductors, GmbH & Co. OHGInventors: Klaus Höhn, Alexandra Debray, Peter Schlotter, Ralf Schmidt, Jürgen Schneider
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Publication number: 20010002049Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.Type: ApplicationFiled: December 7, 2000Publication date: May 31, 2001Applicant: OSRAM OPTO SEMICONDUCTORS GmbH & Co., OHGInventors: Ulrike Reeh, Klaus Hohn, Norbert Stath, Gunter Waitl, Peter Schlotter, Jurgen Schneider, Ralf Schmidt
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Publication number: 20010000622Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.Type: ApplicationFiled: December 6, 2000Publication date: May 3, 2001Applicant: OSRAM OPTO SEMICONDUCTORS GmbH & Co., OHGInventors: Ulrike Reeh, Klaus Hohn, Norbert Stath, Gunter Waitl, Peter Schlotter, Jurgen Schneider, Ralf Schmidt