Abstract: A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.

Abstract: In an embodiment of the invention, an electronic device includes an interfacial layer with traps. This interfacial layer is between an electrode and an organic layer, and if the electrode was adjacent to the organic layer, the energy barrier between these two layers is such that the current through the organic layer is limited by charge injection into this layer rather than the transport properties of the organic layer. The traps are used to accumulate charges of one charge type (e.g., either electrons or holes) within the interfacial layer. By accumulating charges, the bands of the interfacial layer are bent so that charges can tunnel from the electrode to the organic layer thus increasing the efficiency of the electronic device and allowing organic layers to be used within an electronic device that otherwise would be too inefficient for use in that device.