Abstract: A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).

Abstract: An embodiment of an encapsulated organic optoelectronic device is described. The encapsulated device includes an organic optoelectronic device on a substrate and that organic optoelectronic device has a cathode. The encapsulated device further includes a diffusion layer that is on the organic optoelectronic device and that diffusion layer covers exposed areas of the organic optoelectronic device. An adhesive layer is on the substrate and is around a perimeter of the diffusion layer. An encapsulation lid is on the adhesive layer, and a getter is on the encapsulation lid such that the getter overlies the organic optoelectronic device. The diffusion layer slows a rate of absorption of reactive gasses by the cathode and increases a proportion of the reactive gasses absorbed by the getter relative to the cathode.