Abstract: A transport table, comprising a transport web; an unwinding roller for unwinding the transport web therefrom; a first return element; a second return element; a winding roller for winding thereon the unwound transport web; a first frame with which the first and the second return element are connected; and a second frame with which the unwinding roller and the winding roller are rotatably connected, wherein the unwinding roller, the winding roller and the return elements together are designed for stretching the transport web such that between the first and the second return element a surface of the transport web is available as transport surface, and wherein the second frame is movable along a path substantially parallel to said transport surface with respect to the first frame. The invention also discloses a method for the use of the transport table.

Abstract: Assembly and method for depositing a thin film including: providing an expanding thermal plasma plume, including at least one chemical component to be deposited; designating a first and a second deposition zone within the plasma plume, such that the first and second deposition zones have a mutually different relative content of the chemical component; providing a substrate, and transporting said substrate through the plasma plume along a substrate transport path having a substrate transport path direction; and providing a mask that is at least partly disposed in the plasma plume and that shields a portion of the substrate transport path from being deposited on, wherein said shielded portion of the substrate transport path extends in the direction of the substrate transport path and bridges at least the first deposition zone, while it starts or terminates in the second deposition zone.

Abstract: A conveyor assembly suitable for use in a substrate processing system includes: at least one substrate carrier having a substrate-carrying surface configured to support at least one substrate; a processing track; a return track; a drive system configured to drive the substrate carrier along the processing track and the return track; and at least one swivel unit configured to pivot the substrate carrier around a substantially horizontal axis from a first orientation into a second orientation, and/or vice versa. Also provided is a method for conveying a substrate carrier including: providing a substrate carrier; positioning the substrate carrier in a first orientation; conveying the substrate carrier along a first track; and rotating the substrate carrier around a substantially horizontal axis into a second orientation.

Abstract: A method wherein a substrate is provided, wherein, in a scanning step, structures already applied to the substrate are detected by at least one scanning provision of a processing head, wherein the processing head is provided with at least one lighting provision, which lighting provision locally lights the applied lacquer structure in a lighting step by using the information obtained with the scanning step. Further, the invention discloses an apparatus for carrying out the method is described, which apparatus is provided with a processing head which is movable relative to a substrate carrier, wherein the processing head comprises at least one scanning provision and at least one lighting provision.

Abstract: An electronic device includes at least a substrate, an area on the substrate which has to be protected against moisture and/or oxygen, at least one contact, and an encapsulation layer system including at least a first inorganic layer. The at least one contact extends from the sealed area to a part of the substrate not sealed by the encapsulation layer system. The contact includes a shunt, which is an interruption bridged by an electrically conductive bridge. The first inorganic layer of the encapsulation system is applied so that it is in direct physical contact with the electrically conductive bridge. The bridge has a structure and shape which can be sealingly covered by the encapsulation layer system and is made from a material through which no moisture and/or oxygen can penetrate.

Abstract: A cascade source provided with a cathode housing, a number of cascade plates insulated from each other and stacked on top of each other which together bound at least one plasma channel, and an anode plate provided with an outflow opening connecting to the plasma channel, wherein one cathode is provided per plasma channel, which cathode comprises an electrode which is adjustable relative to the cathode housing in the direction of the plasma channel, wherein the clamping provision is preferably of the collet chuck type. Also described is method for controlling the cascade source in use.

Abstract: An in-line process for making a thin film electronic device on a substrate is described comprising the steps of: a) depositing a structurable layer onto a substrate; b) depositing a patternable material onto the structurable layer in a first pattern; and c) etching the structurable layer in areas uncovered by the patternable material. The steps are carried out without intermediate exposure of the substrate to ambient air.

Abstract: A conveyor assembly suitable for use in a substrate processing system includes: at least one substrate carrier having a substrate-carrying surface configured to support at least one substrate; a processing track; a return track; a drive system configured to drive the substrate carrier along the processing track and the return track; and at least one swivel unit configured to pivot the substrate carrier around a substantially horizontal axis from a first orientation into a second orientation, and/or vice versa. Also provided is a method for conveying a substrate carrier including: providing a substrate carrier; positioning the substrate carrier in a first orientation; conveying the substrate carrier along a first track; and rotating the substrate carrier around a substantially horizontal axis into a second orientation.

Abstract: A transport table, comprising a transport web; an unwinding roller for unwinding the transport web therefrom; a first return element; a second return element; a winding roller for winding thereon the unwound transport web; a first frame with which the first and the second return element are connected; and a second frame with which the unwinding roller and the winding roller are rotatably connected, wherein the unwinding roller, the winding roller and the return elements together are designed for stretching the transport web such that between the first and the second return element a surface of the transport web is available as transport surface, and wherein the second frame is movable along a path substantially parallel to said transport surface with respect to the first frame. The invention also discloses a method for the use of the transport table.

Abstract: A cascade source provided with a cathode housing, a number of cascade plates insulated from each other and stacked on top of each other which together bound at least one plasma channel, and an anode plate provided with an outflow opening connecting to the plasma channel, wherein one cathode is provided per plasma channel, which cathode comprises an electrode which is adjustable relative to the cathode housing in the direction of the plasma channel, wherein the clamping provision is preferably of the collet chuck type. Also described is method for controlling the cascade source in use.

Abstract: A cascade source includes a cathode housing, a number of cascade plates insulated from each other and stacked on top of each other which together bound at least one plasma channel, and an anode plate provided with an outflow opening connecting to the plasma channel. One cathode is provided per plasma channel, which cathode includes an electrode which is adjustable relative to the cathode housing in the direction of the plasma channel. The clamp may be of the collet chuck type. At least a part of the housing of the source may be substantially transparent. A method for controlling the cascade source in use includes monitoring the electromagnetic radiation of the plasma through the substantially transparent housing part, and, dependent on the monitored radiation, controlling the plasma forming process in the source by variation of the gas supply, or variation of the potential difference between the cathode and the anode or a combination thereof.

Abstract: A method for applying a thin-film encapsulation layer assembly to an organic device, which comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein the thin-film encapsulation layer assembly is formed by applying at least one organic and at least one inorganic layer applied with PECVD or reactive sputtering, onto the active stack, wherein after application of a first organic layer a metal layer is applied to the first organic layer before an inorganic layer is applied thereto utilizing PECVD or reactive sputtering, wherein the metal layer is applied utilizing a deposition technique that causes relatively little radiation, wherein the metal layer protects the organic layer against radiation upon a subsequent PECVD or reactive sputtering process step for applying an inorganic layer. The invention also relates to an organic device manufactured with such a method.

Abstract: A method for manufacturing a photovoltaic cell, such as a solar cell is disclosed. The method includes: providing a silicon substrate; applying to a side of the silicon substrate, a first layer of a metal with a relatively high optical reflectance, such as a layer of silver; applying to the first layer, a second layer of a metal with a relatively high electrical conductivity coefficient, such as a layer of aluminum or an Al alloy; and then firing the substrate having the first and second layers in order to obtain an alloy of the metals of the first and second layers and the silicon, wherein the alloy formed comprises a maximum amount of metal dissolved in the silicon in amounts up to the eutectic point of the alloy. In one implementation, the alloy is substantially an n-type Si—Al—Ag alloy. Thus, an improved Back Surface Field is formed in the substrate. The invention further relates to a photo voltaic cell obtained with the aid of such method.

Abstract: Electronic device comprising at least: a substrate; an area on the substrate which has to be protected against moisture and/or oxygen; at least one contact; an encapsulation layer system comprising at least a first inorganic layer the at least one contact extending from the said sealed area to a part of the substrate not sealed by the encapsulation layer system, the contact comprising a shunt, i.e. an interruption which interruption is bridged by a electrically conductive bridge; the first inorganic layer of the encapsulation system being applied so that it is in direct physical contact with the electrically conductive bridge; the bridge having a structure and shape which can be sealingly covered by the encapsulation layer system and is made from a material through which no moisture and/or oxygen can penetrate. The invention also provides a method for manufacturing such a device.

Abstract: A system for treating substrates, provided with at least one processing chamber to treat at least one substrate with a vacuum process, wherein said processing chamber is provided with a substrate access closable by a closing body, wherein the system is provided with a conveying device which is at least arranged to move said closing body, wherein said conveying device is arranged to convey a mask, intended to at least partly cover said substrate during said vacuum process, at least between a position outside the processing chamber and a position inside the processing chamber. It is advantageous when at least said substrate holder is provided with positioning means to position the substrate holder and the mask relative to each other. The invention further provides a use of such a system.

Abstract: A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.