Abstract: Wave soldering machine of the type comprising a frame, at least one solder pot mounted on the frame and equipped with a nozzle designed to produce a wave of solder, a conveyor mounted on the frame and designed to carry the printed circuit boards along a substantially linear path, and a device for adjusting the height of the solder pot, thus permitting the adjustment of the height of the wave with respect to the path, machine wherein the frame comprises a moving track of general direction similar to that of the conveyor and on which is mounted the solder pot, the path and track forming together a predetermined angle of small value, and the track having an inclination as small as possible with respect to the horizontal, and a device for adjusting the position of the solder pot along the moving track.