Abstract: A method for image acquisition includes receiving, by an image acquisition computing device, a digitized LiDAR image frame and a thermal image frame of a region of interest from a read out integrated circuit of an image acquisition device coupled to the image acquisition computing device. The LiDAR image frame and the thermal image frame are processed to detect one or more objects of interest located in the region of interest. The detected one or more objects of interest are correlated between the LiDAR image frame and the thermal image frame. The detected one or more objects of interest are identified based on the correlation between the LiDAR image frame and the thermal image frame. An integrated LiDAR and thermal image acquisition device is also disclosed.

Abstract: Photosensitive semiconducting devices, such as bipolar junction transistors (BJTs) can be built up over a substrate that may include a read-out integrated circuit (ROIC). Semiconducting layers can be deposited over the substrate and bottom electrodes that are on or at the substrate's top surface. The bottom electrodes may be the input pads of the ROIC. A top electrode is deposited over the semiconducting layers. The semiconducting layers can form BJTs between the bottom electrodes and the top electrode. The top electrode and the bottom electrodes are the BJTs collectors and emitters. The semiconducting layers include a P-type quantum dot layer and a N-type metal oxide layer. The quantum dots act as light sensors for the ROIC because photons absorbed in a semiconducting layer can produce a BJT base current. The BJTs can be formed without requiring a vacuum or patterning of the top electrode.

Abstract: An imaging apparatus has one or more lenses with a common optical axis and that define an image plane. A splitting optic is disposed to split the light along the optical axis to provide, at the image plane, at least a first copy of an image at a first magnification and a second copy of the image at a second magnification different from the first magnification.

Abstract: Embodiments of systems and methods for multi-aperture ranging are disclosed. An embodiment of a device includes a main lens, configured to receive an image from the field of view of the main lens, a multi-aperture optical component having optical elements optically coupled to the main lens and configured to create a multi-aperture image set that includes a plurality of subaperture images, wherein at least one point in the field of view is captured by at least two of the subaperture images, an array of sensing elements, a ROIC configured to receive the signals, to convert the signals to digital data, and to output the digital data, and an image processing system, responsive to the digital data that is output from the ROIC, which is configured to generate disparity values that correspond to at least one point in common between the at least two subaperture images.

Abstract: Embodiments of systems and methods for multi-aperture ranging are disclosed. An embodiment of a device includes a main lens, configured to receive an image from the field of view of the main lens, a multi-aperture optical component having optical elements optically coupled to the main lens and configured to create a multi-aperture image set that includes a plurality of subaperture images, wherein at least one point in the field of view is captured by at least two of the subaperture images, an array of sensing elements, a ROIC configured to receive the signals, to convert the signals to digital data, and to output the digital data, and an image processing system, responsive to the digital data that is output from the ROIC, which is configured to generate disparity values that correspond to at least one point in common between the at least two subaperture images.

Abstract: A method for image acquisition includes receiving, by an image acquisition computing device, a digitized LiDAR image frame and a thermal image frame of a region of interest from a read out integrated circuit of an image acquisition device coupled to the image acquisition computing device. The LiDAR image frame and the thermal image frame are processed to detect one or more objects of interest located in the region of interest. The detected one or more objects of interest are correlated between the LiDAR image frame and the thermal image frame. The detected one or more objects of interest are identified based on the correlation between the LiDAR image frame and the thermal image frame. An integrated LiDAR and thermal image acquisition device is also disclosed.

Abstract: A trajectory detection device includes a lens configured to receive an image of a field of view. An array of microlenses is configured to create an array of light field images based on the image. A detector array includes a plurality of photon sensitive photodetectors. The detector array is configured to generate output signals from each photodetector based on the array of light field images. A controller is configured to integrate the output signals over an integration period. At least a portion of the output signals are modulated at a modulating frequency having a modulating frequency cycle time that is smaller than the integration period. A three-dimensional image of motion in the field of view is generated based on the integration of the modulated output signals.

Abstract: A trajectory detection device includes a lens configured to receive an image of a field of view. An array of microlenses is configured to create an array of light field images based on the image. A detector array includes a plurality of photon sensitive photodetectors. The detector array is configured to generate output signals from each photodetector based on the array of light field images. A controller is configured to integrate the output signals over an integration period. At least a portion of the output signals are modulated at a modulating frequency having a modulating frequency cycle time that is smaller than the integration period. A three-dimensional image of motion in the field of view is generated based on the integration of the modulated output signals.