Abstract: Disclosed preamplifier circuit comprises amplifier arranged in first current path between input node and output node of the preamplifier circuit. Feedback capacitor is arranged in second current path between said input and output nodes. Feedback circuit having adjustable transfer function is arranged in third current path between said input and output nodes. Reset switch arranged in said third current path enables selectively coupling output of the feedback circuit to input of the amplifier and decoupling output of the feedback circuit from input of the amplifier. Loop controller is arranged selectively, in dependence of voltage in the preamplifier circuit, one of open reset switch to set preamplifier circuit in normal operating mode and close reset switch to set preamplifier circuit in reset mode. Loop controller is arranged to adjust the transfer function of the feedback circuit at least in part in dependence of the current operating mode of the preamplifier circuit.

Abstract: According to an example aspect of the present invention, there is provided a radiation window manufacturing method, comprising patterning a mask on a top surface of a bulk wafer or compound wafer, etching the bulk or compound wafer from the top surface, based on the mask, either by timed etching of the bulk wafer, or until an inner insulator layer of the compound wafer, thereby generating recesses in the bulk or compound wafer, filling the recesses, at least partly, with a filling material, polishing the top surface of the bulk or compound wafer, and providing a membrane layer on the polished top surface, and etching the bulk or compound wafer from a bottom surface, opposite the top surface, to build a supporting structure for the membrane layer in accordance with a shape defined by the mask.

Abstract: Disclosed is a semiconductor radiation detector assembly including a detector chip having a front side for receiving radiation and a back side; and a flexible substrate including a center portion having its front side attached to the back side of the detector chip and a plurality of strips extending from the center portion and bent to protrude away from the detector chip, wherein the flexible substrate includes a plurality of conductive tracks that extend on a surface of the strips from the center portion towards lateral ends of the strips for electrical coupling and mechanical attachment to one of a plurality of contact pins, and wherein the detector chip is electrically coupled to at least one of the conductive tracks.

Abstract: According to an example aspect of the present invention, there is provided a method comprising obtaining a first silicon wafer comprising a mask on a first side, attaching a second silicon wafer on the first side of the first silicon wafer, and etching one of the wafers to partially expose a window layer deposited on the opposite silicon wafer and to leave a structure defined by the mask supporting the window layer.