Abstract: The invention concerns a method for forming a conductive pattern on an insulating substrate and a related apparatus. In the method, particle-type conductive matter is transferred onto a surface of the substrate and the particle-type conductive matter is at least partially sintered at elevated temperature and pressure in order to convert the particle-formed pattern into a continuously conducting pattern affixed to the substrate. According to the invention, the conductive matter is transferred in the form of a predefined pattern, and the sintering is carried out by using a nip comprising two opposing nip members between which the substrate is fed. The method provides an efficient way of making high-resolution conductor structures at low temperatures.