Abstract: A module for a millimeter-wave component having environmentally sensitive components, such as with chip and wire technology, is described which does not require that the entire module be hermetically sealed against the outside elements in order to protect the environmentally sensitive component. A cap is placed over the environmentally sensitive component in order that the vulnerable component itself is protected from the external environment. The less-vulnerable remainder of the millimeter-wave module can withstand limited exposure to environmental conditions and, therefore, is not necessarily sealed.