Abstract: Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

Abstract: A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.

Abstract: This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heater is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heate is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid toward the sides of the component. The nozzle has downwardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board.

Abstract: An in-line solder extractor and a tubular heating assembly for use therewith having a tubular tip disposed within the tubular heating assembly a hollow handle, the heater assembly being mounted with respect to the forward portion of the handle a solder collection chamber disposed within the handle, and forward and rearward seals for sealing the forward and rearward ends.

Abstract: A cleaning unit for cleaning the tip of a soldering iron or solder extractor or the like, the unit including a well for containing a liquid which will shock surface oxides from the tip; a sponge disposed within the well for absorbing the liquid, the sponge having an opening extending therethrough; and a nonmetallic, preferably porous liner in contact with the surface of the opening in the sponge, the nonmetallic liner having an abrasive surface whereby particulate matter may be removed from the tip by the abrasive surface by rubbing the tip thereagainst and said surface oxides may be removed by being brought into contact with the liquid absorbed in the sponge.

Abstract: A nozzle device is adjustably positionable over a component which is disposed on a substrate, for registering relatively precisely against the component relative to the substrate for delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon. A series of changeable nozzles can be used for various component and terminal configurations and can be moved into or out of registry with the component. A vacuum apparatus can be provided for contacting the component to remove the component from the substrate. Notched end portions of inwardly projecting walls on the nozzle provide accurate registration with upper edges of the component, and permit accurate spacing of a skirt portion of the device relatively evenly from the substrate and relatively evenly from the sidewalls of the component.

Abstract: Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle for receiving solder from the reservoir; an element for conveying the molten solder in the reservoir to the nozzle; and a source connected to the contained space for introducing a pressurized gas into the space to raise the solder through the conveying means to a predetermined level within the nozzle and maintaining said solder at said predetermined level to thus effect the operation with the molten solder and then removing the gas to return the solder to the reservoir. The gas is pulsed at least during the time the solder approaches and reaches the predetermined level. The apparatus includes a plurality of different size hollow nozzles for receiving solder from the reservoir where the nozzles are removably attachable with respect to the reservoir.

Abstract: A desoldering device is disclosed having a solder transferring tube in communication with a solder collection chamber and a pivotal handle attached to the solder collection chamber so that the handle may assume within a plane different angular positions with respect to the solder transfer tube without affecting proper orientation of the tubular front portion with respect to a workpiece. Moreover, a switch for controlling the vacuum is disposed on the handle and the handle is rotatable about its own axis so that the vacuum switch may have various orientations with respect to the plane in which the handle may assume different angular positions.

Abstract: An forward seal for a desolderer assembly, comprises a seal mounting means which is spaced from the suction tube. The spacing allows application of higher heat by the heater assembly and desoldering tip combination which facilitates rapid heating of the tip to soldering melting temperatures. An improved heater assembly is also provided which may be removably connected to the desolderer handle. The solder collector tube may be disposed within the desolderer handle and mounted with respect to an outer sleeve of the heater assembly. Means are provided for connecting the heating wire to the space outside the solder collector tube. Means are also provided for removably connecting the desoldering tip within the heater assembly. A removably rear housing including flexible gripping members is mounted at the rear of the desolderer handle.

Abstract: A X-Y table is disclosed having a table rotatably mounted on a base for movement in the X-Y and .theta. directions. The device includes fine adjustments in both X and Y directions and a quick shear mechanism with means for automatically returning the table to its original position after the quick shear procedure. The table may be used as a stand above unit or particularly for use in installing and removing components from printed circuit boards.

Abstract: A desoldering method and apparatus for removal of molten solder from joined parts including a desoldering tool; a vacuum pump connected to the desoldering tool for applying vacuum thereto for removing the solder; a motor for energizing the pump; and circuitry for providing an initial, relatively high, voltage to the motor and for thereafter providing a relatively lower voltage to the motor so that, during the application of the high voltage to the motor, a relatively large pulse of the vacuum is applied to the joined parts to (a) effect removal of substantially all of the molten solder into the desoldering tool and (b) initiate cooldown of the parts and, during the application of the lower voltage to the motor, a relatively lower vacuum is continuously applied to maintain the cooldown of the parts.

Abstract: A mounting structure is disclosed including two pairs of spaced apart parallel rails with a longitudinal slot separating each of the pair. A trackway is formed under each pair of rails and a slider is slidable in the trackway and may be connected to a third rail orthogonally mounted on the pairs of rails, by means of a bolt passing through the slider and engaging a nut in a T-shaped slot in the third rail.

Abstract: A machine for setting eyelets and the like in printed circuit boards includes a generally U-shaped frame having a pair of spaced-apart support arms defining a workpiece receiving zone therebetween, a first tool movably mounted in one of the support arms, and a second tool fixedly mounted in the other support arm and axially aligned with the first tool. An adjustable torque screw is connected to the first tool for moving the first tool into aligned contact with the second tool at a pre-determined eyelet setting pressure. The adjustable torque screw insures that the eyelet setting pressure does not exceed the pre-determined eyelet setting pressure despite continued rotation of the adjustable torque screw.

Abstract: A bobbin assembly for a soldering/desoldering device may be readily produced by utilization of a heater assembly comprising an electrically insulating tape having an etched foil heater in the form of serpentine comprising a plurality of coextensive side by side parallel leg portions bonded to one side thereof. The bobbin assembly is formed by wrapping the heater assembly about a cylindrical bobbin with the heater leg portions parallel to the bobbin axis so as to form a first insulating layer in contact with the bobbin, a layer comprising the heater in contact with the first layer and a second insulating layer in contact with the heater. A wire is then wound about the entire assembly, in a helical manner, to hold all elements in place. Additionally, a dissimilar metal lead may be spot welded to the bobbin to form a thermocouple junction used for sensing the bobbin assembly temperature.

Abstract: Circuitry for detecting a pulse having a duration as short as 10 nanoseconds. The circuitry includes a storage device for storing the peak amplitude of the pulse. Signal resolution enhancement circuitry is responsive to the storage device for establishing a plurality of channels respectively corresponding to a plurality of signal amplitude ranges where the range of signal amplitudes for each successive range is larger than that of the range preceding it. Peak signal detecting circuitry is responsive to the signal resolution enhancement circuitry for (a) scanning the channels, (b) selecting one of the channels, the selected channel being such that the peak amplitude falls within the range for the channel, and (c) detecting the peak amplitude of the pulse.Probe 10 in FIG. 1, may be replaced by an electrostatic sensor, the high input impedance of amplifiers 16 and 18 of FIG. 1 is within range of standard electrostatic charge measurements, thus the invention becomes an electrostatic sensing device.

Abstract: A optical system for stand alone use or for use with a device for attaching modular electronic components to or removing them from a substrate, including a microscope which is horizontally rotatable through 0.degree., +90.degree.. and -90.degree. positions relative to a component to permit viewing of three sides of the component and thus facilitate alignment of the component terminals with leads on the substrate together with inspection of soldered joints. A unit for vertically rotating the microscope through 90.degree. with respect to the component is also disclosed which includes means for quickly positioning and locking the microscope at a preset vertical orientation such as 45.degree. to further facilitate the alignment and inspection functions. Mirrors are also disclosed which enable viewing of three or four sides of a component in the 0.degree. horizontal position of the microscope whereby the above rotation of the microscope to the +90.degree. and -90.degree. positions may be avoided.

Abstract: Locator device for locating modular electronic components centrally with respect to a nozzle of an apparatus for attaching the components to a substrate, such as a printed circuit board. The locator device comprises a component support member for supporting a component to be located centrally with respect to the nozzle of a component attachment apparatus, and a component centralizing element associated with the component support member and engageable with the nozzle for centralizing the component with respect to the nozzle prior to soldering of the component to the printed circuit board. When the component has been centralized with respect to the nozzle, the component is maintained in its centralized position by attachment to a source of vacuum disposed within the nozzle. This facilitates removal of the locator device from the nozzle to leave the component disposed centrally within the nozzle attached to the source of vacuum and ready for installation on the printed circuit board.